Packaging method and packaging body

Abstract

The present invention provides a packaging method and a packaging body. The packaging method comprises a step of providing a carrier, a step of forming one or more pads on the carrier, a step of covering the surface of the carrier with the need of arranging a chip with a pre-filling layer, a step of placing at least one chip on the pre-filling layer, a step of carrying out lead connection of the chip and the pads, and a step of carrying out plastic packaging and removing the carrier to form a package structure. The packaging method and the packaging body have the advantages that the problem of putting a welding line to a chip suspended island can be solved, thus the welding line has good operation, the layout density can be improved, the service life of a cutting knife can be improved, thus the cost is saved, a thinner package body can be obtained, and a series of operating difficulties of a super thin substrate caused by low intensity in the production process is solved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a packaging method and a packaging body. Background technique [0002] Some existing packaging products, such as QFN products, may have no exposed chip pads (exposed pads) or products with chip pads (exposed pads) that are very small. see figure 1 , the frame includes pins 101 and base island 102, the pins 101 are attached to the pre-adhesive film 103, and the pre-adhesive film 103 plays a supporting role, and since there is no exposed heat sink, the frame is half in the area where the chip is placed. Etching design, that is, the base island 102 is half-etched, and the chip 104 is placed on the base island 102. In this way, the wire bonding area on the chip 104 is in a suspended state, resulting in the inability to wire wire or the difficulty of wire bonding, and the workability of the wire bonding. not good. [0003] In the prior art, the method to solve this problem is...

AI Technical Summary

Problems solved by technology

[0004] However, the above method has certain limitations. When the thickness of the frame is very thin, the space for accommodating the glue is small, the frame will be deformed, the glue will overflow, and the yield rate of the pre-injection glue process will be greatly lost, and the frame deformation is difficult to control. , the thinner the frame, the more deformation will occur during the manufacturing process, and the glue overflow situation is very serious

Spilled glue may spread to the pins, affecting the performance of the product

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