Inner layer golden finger secondary laser outline machining method

Abstract

The invention discloses an inner layer golden finger secondary laser outline machining method. The machining method comprises the following steps of 1, presetting inner layer circuit optical points: pre-setting the optical points on the periphery of an inner layer flexible board golden finger circuit within a certain range, and windowing in the positions, corresponding to the optical points, of a covering film and a PP cut material; and 2, optimizing an outline file into three times of shaping, including uncovering a pre-milled groove for the first time, performing laser shaping for the second time, and performing CNC numerical control outline milling for the third time. According to the inner layer golden finger secondary laser outline machining method, through positioning of the inner layer golden finger pre-set optical points, and optimization of the outline CNC file into a three-time shaping mode, high-precision-dimension machining of the inner layer golden finger is realized; the dimensional tolerance of minus and plus 0.05mm of the golden finger can be satisfied; and the purpose of improving efficiency and quality is achieved.

Description

technical field [0001] The invention relates to the technical field of manufacturing a rigid-flexible printed circuit board, in particular to a method for processing a secondary laser shape of an inner gold finger. Background technique [0002] The rigid-flex board is a circuit board formed by combining thin-layer flexible inner layers and rigid inner layers together and then laminating them. It changes the traditional planar design concept and extends it to a three-dimensional three-dimensional space. It can use a single component to replace a composite printed circuit board connected by multiple connectors, multiple cables and ribbon cables, especially those with gold fingers. Rigid-flex boards can better solve the interconnection between functional modules of electronic equipment, with stronger performance and higher stability, so they are favored by more and more design manufacturers. However, with the rapid development of electronic products, the precision of rigid-fle...

AI Technical Summary

Problems solved by technology

However, with the rapid development of electronic products, the precision of rigid-flex boards is getting higher and higher, and customers have put forward higher requirements for the dimensional accuracy of the gold finger. With the traditional CNC milling shape, the overall dimensional accuracy of the gold finger end can be achieved. The control is within ±0.1mm, but using the second dimension to measure the distance from the gold finger to the edge, about 50% of the boards have the problem of gold finger offset, that is, the gold finger is not centered, the width of both ends is asymmetrical, and the serious deviation is as high as 0.15mm~ 0.20mm, unable to meet the customer's high-precision requirements for gold finger processing