Microcircuit module back side pre-soldering and pre-soldering heating device
A microcircuit and backside technology, which is applied in printed circuit, printed circuit manufacturing, printed circuit assembly of electrical components, etc., can solve the problems that affect the welding reliability of components, reduce the service life, and the solder is easy to oxidize, so as to ensure reliability and stability, save the amount of solder, reduce the effect of solder oxidation
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[0027] The embodiments of the present invention will be described in detail below in conjunction with the drawings.
[0028] The pre-tinning method on the back of the microcircuit module includes the following steps:
[0029] A. Production tooling 2: Prepare an aluminum-silicon plate, plate the center area of the aluminum-silicon plate with gold, and divide the upper surface of the aluminum-silicon plate into a coating area 21 and an uncoated area 22 to make a tool;
[0030] B. Preheating of tooling 2 and work piece 3: Fix tooling 2 on hot stage 1 and start hot stage 1 to heat the tooling to the preset temperature, place the workpiece to be pre-tinned on hot stage 2, and start hot stage 2 Preheat the workpiece;
[0031] C. Add solder: place the solder in the gold-plated area 21 of the tooling to melt the solder;
[0032] D. Tinning: Move the preheated workpiece 3 to the plating area 21 of the tooling 2, and the back of the workpiece 3 is in contact with the solder and rubs on the pl...
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