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A mems three-axis inertial sensor based on thermal expansion airflow and its processing method

A three-axis inertial and sensor technology, applied in the field of inertial measurement, can solve the problems of obvious thermal resistance effect and the inability of thermal components to fully release thermal stress, and achieve the effects of simple processing technology, improved linearity and sensitivity, and low cost

Active Publication Date: 2019-08-20
GOERTEK MICROELECTRONICS CO LTD
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Problems solved by technology

[0006] The invention provides a MEMS three-axis inertial sensor based on thermal expansion airflow and its processing method to solve the problem that the heat-sensitive element of the existing thermal expansion airflow gyroscope cannot fully release the thermal stress, resulting in obvious thermal resistance effect

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  • A mems three-axis inertial sensor based on thermal expansion airflow and its processing method
  • A mems three-axis inertial sensor based on thermal expansion airflow and its processing method
  • A mems three-axis inertial sensor based on thermal expansion airflow and its processing method

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0022] Aiming at the problem in the prior art that the thermal stress generated by the thermal element cannot be fully released due to structural limitations of the MEMS three-axis inertial sensor, this embodiment provides a MEMS three-axis inertial sensor with improved structure.

[0023] In this embodiment, the MEMS three-axis inertial sensor based on thermal expansion air flow includes: a sealed cavity surrounded by an upper cover and a PCB substrate, and a MEMS chip is arranged on the PCB substrate in the sealed cavity, and the MEMS chip is connected to the sealed cavity through the PCB substrate. The detection circuit outside the cavity is electrically connected. A detection cavity is set at the center of the MEMS chip, and a heati...

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Abstract

The invention discloses an MEMS three-axis inertial sensor based on thermal expansion airflow and a processing method thereof. The MEMS three-axis inertial sensor comprises a sealing cavity body surrounded by an upper cover and a PCB substrate, an MEMS chip is arranged on the PCB substrate in the sealing cavity body, and the MEMS chip is electrically connected to a detection circuit outside the sealing cavity body through the PCB substrate; the center position of the MEMS chip is provided with a detection cavity, a heating element is hung over the detection cavity, the edges of the detection cavity is provided with multiple sets of thermosensitive components centrally symmetric with the heating element, each set of thermosensitive components comprise two symmetrically arranged thermosensitive elements, and both sides of each thermosensitive element are free ends. By arranging both side of each thermosensitive element as free ends, after the thermosensitive element is electrified to work, thermal stress can be fully released, influence on a piezoresistive effect can be reduced, and linearity and sensitivity of the MEMS three-axis inertial sensor can be improved.

Description

technical field [0001] The invention relates to the technical field of inertial measurement, in particular to a MEMS three-axis inertial sensor based on thermal expansion airflow and a processing method thereof. Background technique [0002] Micro-Electro-Mechanical System (MEMS) is a cutting-edge technology that uses silicon-based semiconductor technology to manufacture micro-machines. The combination of MEMS technology and gyroscope technology has produced many micro gyroscopes with new principles. Among them, MEMS fluid gyroscopes are more and more concerned by MEMS gyroscope researchers. [0003] MEMS fluid gyroscopes use fluid (mostly gas) as the working medium and do not require vibrating masses or other moving parts, thus overcoming the problems of MEMS vibrating gyroscopes such as poor impact resistance, easy fatigue structure, and sliding / pressing film damping. [0004] MEMS fluid gyroscopes mainly include MEMS gyroscopes based on forced convection (also known as ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01C19/00G01C25/00
Inventor 巩向辉
Owner GOERTEK MICROELECTRONICS CO LTD
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