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Cable connection structure and endoscope device

A cable and structure technology, which is applied in the field of cable connection structures and endoscope devices, can solve the problems of high adhesion strength and application of connecting parts, and achieve the effect of preventing substrate peeling

Active Publication Date: 2018-10-30
OLYMPUS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The front end of the endoscope can be bent freely in the up, down, left, and right directions by being connected to a bending part that can bend in multiple directions. However, stress is applied to the connecting part of the electrode and the cable due to the action of the bending part, so the connecting part requires more high bonding strength

Method used

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  • Cable connection structure and endoscope device
  • Cable connection structure and endoscope device
  • Cable connection structure and endoscope device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0034] figure 1 It is a diagram schematically showing the overall configuration of an endoscope system according to an embodiment of the present invention. Such as figure 1 As shown, the endoscope device 1 has an endoscope 2 , a universal cable 6 , a connector 7 , a light source device 9 , a processor (control device) 10 , and a display device 13 .

[0035] The endoscope 2 captures in-vivo images of the subject by inserting the insertion unit 4 into the body cavity of the subject, and outputs imaging signals. The cable harness inside the universal cable 6 extends to the distal end of the insertion portion 4 of the endoscope 2 and is connected to the imaging device provided at the distal end portion 31 of the insertion portion 4 .

[0036] The connector 7 is provided at the base end of the universal cable 6, and is connected to the light source device 9 and the processor 10, and performs predetermined signal processing on the imaging signal output from the imaging device at t...

Embodiment approach 2

[0056] In the cable connection structure according to Embodiment 2, the solder resist layer is formed on the base material so as to cover both end portions of the external connection electrodes perpendicular to the axial direction of the signal cable. Image 6 It is a top view of the cable connection structure of Embodiment 2 of this invention. Figure 7 is along Image 6 Sectional view of the B-B line. In addition, in Image 6 The solder that connects the signal cable to the electrode is omitted.

[0057] Such as Image 6 with Figure 7 As shown, the solder resist layer 70 is formed on the base material 50A so as to cover both ends of the external connection electrode 51 perpendicular to the axial direction of the signal cable 48 , forming a solder resist layer-limited structure.

[0058] Further, a via hole 52A is formed on the base end side of the signal cable 48 at both end portions of the external connection electrode 51 perpendicular to the axial direction of the si...

Embodiment approach 3

[0064] In the cable connection structure of Embodiment 3, the via holes are respectively provided at both end portions of the external connection electrode 51 perpendicular to the axial direction of the signal cable 48 . Figure 9 It is a top view of the cable connection structure of Embodiment 3 of this invention. Figure 10 is along Figure 9 Sectional view of line C-C. In addition, in Figure 9 The solder that connects the signal cable to the electrode is omitted.

[0065] Such as Figure 9 with Figure 10 As shown, a solder resist layer 70C is formed on the base material 50C so as to cover both ends of the external connection electrode 51 perpendicular to the axial direction of the signal cable 48 , forming a solder resist layer-limited structure.

[0066] Further, a via hole 52C- 1 and a via hole 52C- 2 are respectively provided on the base end side and the other end side of the signal cable 48 at both end portions of the external connection electrode 51 perpendicula...

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Abstract

Provided are a cable connection structure and an endoscope device capable of preventing electrodes from being peeled off from a substrate. The cable connection structure of the present invention is a cable connection structure in which a signal cable (48) covering a core wire (60) with a sheath (61) made of an insulator is connected to a substrate (39). The structure is characterized in that the substrate (39) has: a base material (50), which is made of an insulator; an external connection electrode (51), which is connected to the core wire (60); and a via hole (52), whose end is connected to the signal cable The mounting surface of the wire (48) is exposed, and the via hole (52) is at least provided on the base of the signal cable (48) in both ends of the external connection electrode (51) perpendicular to the axial direction of the signal cable (48). end side.

Description

technical field [0001] The present invention relates to a cable connection structure and an endoscope device. Background technique [0002] Conventionally, medical endoscopes have been able to observe lesioned areas by inserting their insertion parts deeply into the body, and they have been used in combination with treatment instruments to perform inspections and treatments in the body as needed. Such an endoscope is provided with an imaging element such as a CCD at the tip of the insertion portion, and outputs data from the imaging element to an external control device or the like via cables connected to electrodes on a substrate. The front end of the endoscope can be bent freely in the up, down, left, and right directions by being connected to a bending part that can bend in multiple directions. However, due to the action of the bending part, stress is applied to the connecting part of the electrode and the cable, so the connecting part requires more High adhesion strengt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61B1/00G02B23/24H05K3/46
CPCA61B1/00096A61B1/00114A61B1/00124A61B1/051G02B23/2423G02B23/2476H05K1/113H05K1/117H05K3/32H05K3/3452H05K2201/09809H05K2201/09909H05K2201/10356
Inventor 三上正人
Owner OLYMPUS CORP
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