Device for manufacturing electroplated diamond wire saw

Abstract

The invention discloses a device for manufacturing an electroplated diamond wire saw. The device comprises a wire unwinding chamber, a pretreatment tank, a sand feeding tank, a thickening tank, a drying chamber and a wire winding chamber; a cathode of the sand feeding tank is connected with a negative electrode of a power supply through a conductive shaft; a conductive cathode wheel is connected to the conductive shaft through a metal bearing; a base wire is wound on the conductive cathode wheel; the cathode of the thickening tank is also connected with the negative electrode of the power supply through the conductive shaft; the conductive cathode wheel is connected to the conductive shaft through the metal bearing; the base wire is wound on the conductive cathode wheel. According to the device disclosed by the invention, in the sand feeding tank and the thickening tank, each base wire is wound on the cathode wheel of the corresponding cathode so that the base wire becomes a negative electrode; each metal bearing mounted between the corresponding cathode wheel and the corresponding conductive shaft is capable of guaranteeing good electric conductivity and is also capable of making the corresponding cathode wheel rotate freely, so breakage of each base wire is prevented. In comparison with the previous conduction ways such as electric brush, the conduction way of the device disclosed by the invention is capable of enhancing the electric conductivity, free of loss, free of generation of graphite dust, and conductive to uniformity and wire diameter consistency of electroplated diamond particles on each base wire.

Description

technical field

[0001] The invention relates to production equipment of diamond wire saws, in particular to a production device of electroplated diamond wire saws. Background technique

[0002] With the increasing application of hard and brittle materials, the processing requirements are getting higher and higher, especially for the precision cutting of precious hard and brittle materials such as single crystal silicon and gemstones. However, the high-efficiency and precise cutting of hard and brittle materials in my country is still in the development stage, with low processing efficiency and serious material waste.

[0003] In order to solve the above problems, research on bonded abrasive wire saws has attracted more and more attention, especially electroplated diamond wire saws. Diamond wire saws firmly hold high hardness and high wear resistance diamond abrasive grains on steel wires A cutting tool made on a substrate. In addition, the electroplated diamond wire saw ha...

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