Aqueous cleaning agent composition and cleaning agent for printed circuit board and its preparation method and application

Abstract

The present invention relates to the field of printed circuit board cleaning, and discloses an aqueous cleaning agent composition having advantages of environmental protection, no use of a surfactant and good cleaning effect and used for printed circuit boards, an aqueous cleaning agent prepared from the composition and used for printed circuit boards, and a cleaning method for printed circuit boards by using the cleaning agent. The composition comprises a water-soluble alcohol ether, a water-insoluble dibasic acid ester, a defoamer, a nonionic organic reducing agent and a nonionic organic saponification agent, wherein the defoamer is dipropylene glycol propyl ether. According to the present invention, with the aqueous cleaning agent for the printed circuit boards, the residual soldering flux, the high temperature oxide, the grease and the other harmful substances can be completely cleared within 15 min, and the cleaning process can be completed through the direct baking without the rinsing; and the welding point of the cleaned circuit board is bright, no residue is generated under the observing with the 4 times magnifying glass, and the surface insulation resistance and the ion residue concentration can meet the requirements of the IPC standards.

Description

technical field [0001] The present invention relates to an aqueous cleaning agent composition and cleaning agent for printed circuit boards and a preparation method and application thereof, in particular to an aqueous cleaning agent composition for printed circuit boards, and a combination of aqueous cleaning agents for printed circuit boards The water-based cleaning agent for printed circuit boards prepared from the product, the preparation method of the water-based cleaning agent for printed circuit boards, and the cleaning method and application of printed circuit boards using the water-based cleaning agent for printed circuit boards. Background technique [0002] At present, there are mainly two methods for post-soldering cleaning of circuit boards. The first method is a method of cleaning with a solvent, which uses a chlorofluorocarbon solvent or ethanol / isopropanol to clean the residue after welding. The second method is the method of cleaning with a surfactant, which...

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Problems solved by technology

[0003] But, adopt the method for cleaning with solvent, its volatile organic compound (VOC) discharges huge, and has bad influence on environment; And, chlorofluorocarbon solvent is huge to ozone layer damage, has been strictly restricted to use; Ethanol / isopropanol solvent In addition to the fast volatilization speed and high VOC emission, the flash point itself is low, and the electrostatic discharge electrode is easy to cause combustion and explosion, so the explosion-proof requirements for the production environment are very high

[0004] Using surfactants for cleaning, there is a problem that the surfactant itself has residues on the PCB board. After cleaning, it needs to be rinsed with deionized water, which is a huge waste of water resources, and the COD of the rinsing water is seriously exceeded, and it needs to be treated before it can be discharged; in addition , the loading capacity of the surfactant is limited. After several cleanings, the surfactant is saturated and cannot continue to adsorb and remove pollutants, so it needs to be replaced frequently

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