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A kind of phenolic foam of 3-nitro-4-hydroxyethylaminophenol formaldehyde and preparation method thereof

A technology for hydroxyethylaminophenol and phenolic foam, which is applied in the field of phenolic foam and its preparation, can solve the problems of decreased fire resistance, long reaction time, low efficiency and the like, achieves excellent heat resistance and mechanical properties, simple preparation process, Heat resistance improvement effect

Active Publication Date: 2018-08-07
SHENYANG INSTITUTE OF CHEMICAL TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, small molecules such as water or ammonia will be released during the curing process of phenolic foam, and pressure is often required during curing molding, resulting in high brittleness, easy pulverization, and porosity of the foam, which hinders its application development
At present, the existing technologies lead to the decrease of fire performance while toughening, or increase the cost
Therefore, the traditional phenolic foam cannot meet the needs of the current market for high-performance tough foam. Improving the toughness and heat resistance of the foam is the current key research direction of phenolic resin foam insulation materials.
[0003] Patent 103923285A provides a cardanol-modified nitrogen-containing phenolic resin. The structure of the phenolic resin provided by the invention includes both cardanol side groups and N elements. It overcomes the brittleness of phenolic resins in the prior art. At the same time, it improves the high temperature resistance of phenolic resin, but this method has a long reaction time and low efficiency

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The present invention is a phenolic foam of 3-nitro-4-hydroxyethylaminophenol formaldehyde, which comprises the following steps:

[0034] Add 65g of 3-nitro-4-hydroxyethylaminophenol solution and 0.65g of sodium hydroxide solution with a mass fraction of 50% into a three-necked flask at 60℃, mix well, react for 5min, and then weigh 35g of polymer After the formaldehyde was reacted in the flask for 1 hour, the temperature was slowly raised to 150°C at a heating rate of 3°C / min, and the temperature was stirred for 1.5 and then cooled to room temperature. The resin is neutralized with acetic acid to obtain the target phenolic foamed resin.

[0035] Mix the phenolic foaming resin, Tween-80, n-pentane: benzenesulfonic acid in a ratio of 100:12:10:12, and stir quickly for 1 minute, then transfer the mixed materials to the mold. React for 10 minutes at 70°C and demold to obtain a phenolic foam board for performance testing.

Embodiment 2

[0037] The present invention is a phenolic foam of 3-nitro-4-hydroxyethylaminophenol formaldehyde, which comprises the following steps:

[0038] Add 65g of 3-nitro-4-hydroxyethylaminophenol solution and 0.65g of sodium hydroxide solution with a mass fraction of 50% into a three-necked flask at 60°C, mix well, react for 5 minutes, and then weigh 40g of polymer After the formaldehyde was reacted in the flask for 1 hour, the temperature was slowly raised to 150°C at a heating rate of 3°C / min, and the temperature was stirred for 1.5 and then cooled to room temperature. The resin is neutralized with acetic acid to obtain the target phenolic foamed resin.

[0039] Mix the phenolic foaming resin, Tween-80, n-pentane: benzenesulfonic acid in a ratio of 100:12:10:12, and stir quickly for 1 min. Then transfer the mixed materials to the mold. React for 10 minutes at 70°C and demold to obtain a phenolic foam board for performance testing.

Embodiment 3

[0041] The present invention is a phenolic foam of 3-nitro-4-hydroxyethylaminophenol formaldehyde, which comprises the following steps:

[0042] Add 65g of 3-nitro-4-hydroxyethylaminophenol solution and 0.65g of sodium hydroxide solution with a mass fraction of 50% into a three-necked flask at 60℃, mix well, react for 5 minutes, and then weigh 45g of polymer After the formaldehyde was reacted in the flask for 1 hour, the temperature was slowly raised to 150°C at a heating rate of 3°C / min, and the temperature was stirred for 1.5 and then cooled to room temperature. The resin is neutralized with acetic acid to obtain the target phenolic foamed resin.

[0043] Mix the phenolic foaming resin, Tween-80, n-pentane: benzenesulfonic acid in a ratio of 100:12:10:12, and stir quickly for 1 minute, then transfer the mixed materials to the mold. React for 10 minutes at 70°C and demold to obtain a phenolic foam board for performance testing.

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Abstract

A phenolic foam of 3‑nitro‑4‑hydroxyethylaminophenol formaldehyde and a preparation method thereof, relating to a phenolic foam and a preparation method thereof, the invention consists of: phenolic compound, aldehyde compound, catalyst, surfactant , foaming agent, curing agent. The modified phenolic foam obtained is made of modified phenolic resin, surfactant, and foaming agent mixed uniformly in a certain proportion, then added with a curing agent and mixed uniformly, poured into a mold, foamed at a certain temperature, and demolded to obtain Target phenolic foam. The heat resistance and dimensional stability of the phenolic foam provided by the invention are obviously improved, and have good mechanical properties and comprehensive properties. Mainly used in thermal insulation and sound insulation and other fields. Especially as thermal insulation materials, it is widely used in the fields of construction, petrochemical industry, medicine and health, and ship transportation.

Description

Technical field [0001] The invention relates to a phenolic foam and a preparation method thereof, in particular to a phenolic foam of 3-nitro-4-hydroxyethylaminophenol formaldehyde and a preparation method thereof. Background technique [0002] Phenolic foam has received attention again for its excellent properties such as thermal insulation, flame retardancy, low smoke generation during combustion, low toxicity, and dimensional stability. Its technical research and application development have become active again and have become " New candidates for thermal insulation materials". However, during the curing process of phenolic foam, small molecules such as water or ammonia are released, and pressure is often required during curing and molding, which results in high brittleness, easy pulverization and pores of the foam, thus hindering its application development. At present, the existing technologies are toughening and at the same time lead to a decrease in fire resistance or inc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/16C08L61/08C08J9/14
CPCC08G8/16C08J9/141C08J2203/14C08J2361/08C08L61/06C08L2201/08C08L2203/14
Inventor 葛铁军王成城王佳唐恺鸿徐志华
Owner SHENYANG INSTITUTE OF CHEMICAL TECHNOLOGY