High-temperature-resistant conductive adhesive for pantograph overall slide plate of high speed train
A high-speed EMU, pantograph technology, applied in conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of pantograph catenary accident, temperature rise, separation of carbon strips and aluminum brackets, etc. The effect of improving safety and temperature resistance
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Embodiment 1
[0016] A high-temperature-resistant conductive adhesive for the integral slide plate of the pantograph of a high-speed EMU, the adhesive uses a composition of multifunctional epoxy resin and 2-methyl 4-ethylimidazole as the adhesive, wherein the multifunctional epoxy resin is a single Component modified high temperature resistant epoxy adhesive SL3352 is a mixed resin of four-functional epoxy resin and H-51 three-functional epoxy resin. At the same time, modified amine curing agent G-8402 is used as curing agent, 300 mesh copper powder is used as filler and conductive material, and 50 mesh copper mesh is used as conductive material. When applying, first apply the configured conductive adhesive on the bonding surface of the aluminum bracket, and then place a 50-mesh copper mesh to close and solidify, that is, to form an operational bond in the order of aluminum bracket-conductive adhesive-copper mesh-carbon strip.
Embodiment 2
[0018] On the basis of Example 1, a high-temperature-resistant conductive adhesive for the overall slide plate of the pantograph of a high-speed EMU, the formula of the high-temperature-resistant conductive adhesive is as follows:
[0019] Four-functional epoxy resin: three-functional epoxy resin=100:40 (mass ratio);
[0020] Multifunctional epoxy resin: 2-methyl 4-ethylimidazole=100:2.5 (mass ratio);
[0021] Multifunctional epoxy resin: copper powder = 100:110 (mass ratio);
[0022] Multifunctional epoxy resin: modified amine curing agent=100:20 (mass ratio);
[0023] Apply the prepared conductive adhesive on the bonding surface of the aluminum bracket, and then place a 50-mesh copper mesh to close and solidify, that is, to form an operational bond in the order of aluminum bracket-conductive adhesive-copper mesh-carbon strip.
Embodiment 3
[0025] On the basis of Example 1, a high-temperature-resistant conductive adhesive for the overall slide plate of the pantograph of a high-speed EMU, the formula of the high-temperature-resistant conductive adhesive is as follows:
[0026] Four-functional epoxy resin: three-functional epoxy resin=100:45 (mass ratio);
[0027] Multifunctional epoxy resin: 2-methyl 4-ethylimidazole=100:2 (mass ratio);
[0028] Multifunctional epoxy resin: copper powder = 100: 105 (mass ratio);
[0029] Multifunctional epoxy resin: modified amine curing agent=100:18 (mass ratio);
[0030] Apply the prepared conductive adhesive on the bonding surface of the aluminum bracket, and then place a 50-mesh copper mesh to close and solidify, that is, to form an operational bond in the order of aluminum bracket-conductive adhesive-copper mesh-carbon strip.
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