Magnetron sputtering film coating device capable of automatically controlling plasma parameters

A magnetron sputtering coating and plasma technology, which is applied in the field of plasma parameter automatic control magnetron sputtering coating device, can solve the problems that the coating time and film thickness cannot be accurately controlled, and achieve precise control of the film thickness, The effect of good deposition effect and fast deposition rate

Inactive Publication Date: 2017-03-22
合肥优亿科机电科技有限公司
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Problems solved by technology

[0005] Aiming at the deficiencies of the existing technology, the present invention provides a magnetron sputtering coating device with automatic control of plasma parameters, which solves the problem that the magnetron sputtering coating equipment in the prior art requires pure manual operation, and the coating time and film thickness cannot be precisely controlled. technical issues

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  • Magnetron sputtering film coating device capable of automatically controlling plasma parameters

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Embodiment Construction

[0022] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0023] Such as figure 1 As shown, in the embodiment of the present invention, a magnetron sputtering coating device with automatic control of plasma parameters is disclosed, including a device body, the device body includes a vacuum chamber 1 and a plasma radio frequency power supply 13 connected to the vacuum chamber 1, and the vacuum chamber 1 ...

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Abstract

The invention discloses a magnetron sputtering film coating device capable of automatically controlling plasma parameters. The magnetron sputtering film coating device comprises a vacuum room and a plasma radio-frequency power supply; a motive seal structure used for penetrating through a plasma probe is arranged on the vacuum room, and the output end of the plasma probe is connected with the input end of a data collecting and processing system; and the output end of the data collecting and processing system is connected with the input end of a PC, the output end of the PC is connected with the input end of a PLC, and the output end of the PLC is connected with the plasma radio-frequency power supply. According to the magnetron sputtering film coating device capable of automatically controlling the plasma parameters, a plasma probe system is treated as a monitoring way of the plasma parameters, and the PC and the PLC are treated as operation units to control the parameters in the magnetron sputtering film coating process, so that the magnetron sputtering film coating process is complete in intelligent automation, and a high-quality finished film is manufactured.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering coating, in particular to a magnetron sputtering coating device with automatic control of plasma parameters. Background technique [0002] Plasma is a state of high-energy aggregation of matter. Its energy range is higher than that of gaseous, liquid, and solid matter. It is called the fourth state of matter. There are electrons, ions, and neutral particles with a certain energy distribution. The energy of particles in low-temperature plasma is generally about several to tens of electron volts, which is greater than the bonding energy of polymer materials (several to tens of electron volts), and far lower than the high-energy radioactive rays. It only involves the surface of the material and does not affect properties of the substrate. [0003] Plasma magnetron sputtering coating is a new technology developed rapidly in the 1970s, and it has been practically applied in industrial p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/54C23C14/35
CPCC23C14/35C23C14/542
Inventor 滕海燕
Owner 合肥优亿科机电科技有限公司
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