An integrated circuit substrate

Abstract

The invention relates to an integrated circuit substrate. The substrate comprises a copper coated core board, wherein the circuit function of the integrated circuit package substrate is favorably improved or extended by forming an annular groove for accommodating a magnetic ring in the copper coated core board, i.e., a micro transformer can be integrated in the integrated circuit substrate by winding connection on via holes which are internally and externally distributed along the magnetic ring, the copper coated core board is characterized by comprising a substrate body, the substrate body comprises the copper coated core board, the copper coated core board comprises a core board, an upper copper coated layer and a lower copper coated layer, the upper copper coated layer is combined with a surface of the core board, the lower copper coated layer is combined with a bottom surface of the core board, the annular groove is formed in the core board and is provided with an opening facing upwards, and the opening extends out of the upper copper coated layer.

Description

Technical field [0001] The present invention relates to integrated circuit packaging technology, in particular to an integrated circuit substrate. The substrate includes a copper-clad core board. By providing an annular groove for accommodating a magnetic ring in the copper-clad core board, it is beneficial to improve or expand the performance of the integrated circuit packaging substrate. For the circuit function, for example, the micro-transformer can be integrated into the integrated circuit substrate by winding and connecting the vias distributed along the inside and outside of the magnetic ring. Background technique [0002] Due to the vigorous development of new energy, there are more and more isolation application requirements and higher and higher isolation voltages. The semiconductor isolation technology replaces the traditional optocoupler technology with higher efficiency, higher integration, and supports higher transmission rates, which is in line with the development ...

AI Technical Summary

Problems solved by technology

Because the inductance is not large enough, the signal transmission has to use 180MHz modulation signal, the circuit is very complicated, and the magnetic circuit in the circuit is not closed, the magnetic flux leakage is large, and the EMI electromagnetic interference space radiation is large

The inventors found that for the semiconductor isolation technology using the micro-transformer scheme, due to the inductance of the micro-transformer scheme, the coupling coefficient is too low, and the complexity of the transmission circuit is also increased, and the efficiency of the integrated power supply is poor.

For some capacitive isolators, users need to add an external transformer

In addition, capacitive isolation cannot integrate the power supply of the switch internally, which is inconvenient for customers to use

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