The invention discloses a plating method of an aluminum matrix composite electronic packaging shell. The method comprises the following steps: activating for the first time, chemical plating of nickeland phosphorus, activating for the second time, chemical plating of nickel and boron, electroplating of nickel and electroplating of gold. By means of the plating method, a composite plating layer structure of a first palladium atom activation layer, a nickel-phosphorus chemical nickel plating layer, a second palladium atom activation layer, a nickel-boron chemical nickel plating layer, a nickelelectroplating layer and a gold electroplating layer can be sequentially formed on the outer side of the aluminum matrix composite electronic packaging shell, wherein the two palladium atom activationlayers and the multiple composite nickel plating layers form compact middle transition plating layers for effective filling and covering effects on a microporous aluminum matrix composite, the plating layers are compact, and the outermost layer is plated with the high-purity gold electroplating layer, so that the salt spray resistance is fully improved, the composite plating layer can effectivelyovercome the defect of inconsistency of the surface of the aluminum matrix composite, and the 48-hour salt spray resistance requirement is completely met.