Plating method of aluminum matrix composite electronic packaging shell

An aluminum-based composite material and electronic packaging technology, which is applied in the direction of superimposed layer plating, liquid chemical plating, metal material coating technology, etc., can solve the problem of low comprehensive performance of aluminum-based composite materials and limited improvement in corrosion resistance and other problems, to achieve the effect of overcoming surface inconsistency defects, dense coating, and improving salt spray resistance

Pending Publication Date: 2021-01-19
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the existing coating structure has limited improvement on the corrosion resistance of aluminum matrix composites,...

Method used

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  • Plating method of aluminum matrix composite electronic packaging shell

Examples

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Embodiment 1

[0021] A method for coating an aluminum-based composite material electronic packaging shell, the steps are as follows:

[0022] The first activation: immerse the aluminum-based composite material in the palladium-containing activation solution, the temperature is controlled at 50±5°C, circulate and filter, soak for 1 minute, take it out and rinse it, and form the first palladium atom activation layer on the surface of the aluminum-based composite material .

[0023] Electroless nickel-phosphorus plating: immerse the aluminum-based composite material activated for the first time in the nickel-phosphorus plating solution, the temperature is controlled at 89±2°C, the pH is 4.6±0.2, the nickel ion concentration is 5±0.2g / L, and the circulation is filtered , forming a nickel-phosphorus electroless nickel coating on the outside of the first palladium atom activation layer; the thickness of the nickel-phosphorus electroless nickel coating is 3 ± 0.5 μm, and the mass content of phosph...

Embodiment 2

[0030] A method for coating an aluminum-based composite material electronic packaging shell, the steps are as follows:

[0031] The first activation: immerse the aluminum-based composite material in the palladium-containing activation solution, the temperature is controlled at 50±5°C, circulate and filter, soak for 5 minutes, take it out and rinse it, and form the first palladium atom activation layer on the surface of the aluminum-based composite material .

[0032] Electroless nickel-phosphorus plating: immerse the aluminum-based composite material activated for the first time in the nickel-phosphorus plating solution, the temperature is controlled at 89±2°C, the pH is 4.6±0.2, the nickel ion concentration is 5±0.2g / L, and it is circulated and filtered. A nickel-phosphorus electroless nickel coating is formed on the outside of the first palladium atom activation layer; the thickness of the nickel-phosphorus electroless nickel coating is 6.5±1 μm, and the mass content of phos...

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Abstract

The invention discloses a plating method of an aluminum matrix composite electronic packaging shell. The method comprises the following steps: activating for the first time, chemical plating of nickeland phosphorus, activating for the second time, chemical plating of nickel and boron, electroplating of nickel and electroplating of gold. By means of the plating method, a composite plating layer structure of a first palladium atom activation layer, a nickel-phosphorus chemical nickel plating layer, a second palladium atom activation layer, a nickel-boron chemical nickel plating layer, a nickelelectroplating layer and a gold electroplating layer can be sequentially formed on the outer side of the aluminum matrix composite electronic packaging shell, wherein the two palladium atom activationlayers and the multiple composite nickel plating layers form compact middle transition plating layers for effective filling and covering effects on a microporous aluminum matrix composite, the plating layers are compact, and the outermost layer is plated with the high-purity gold electroplating layer, so that the salt spray resistance is fully improved, the composite plating layer can effectivelyovercome the defect of inconsistency of the surface of the aluminum matrix composite, and the 48-hour salt spray resistance requirement is completely met.

Description

technical field [0001] The invention belongs to the field of microelectronic packaging, and in particular relates to a plating method for an electronic packaging shell of an aluminum-based composite material. Background technique [0002] Aluminum-based composite material is an excellent base material for packaging shells. Compared with metal materials for packaging such as Kovar, cold-rolled phase steel, and oxygen-free copper, it has the following significant performance advantages. Aluminum-based composite materials have the characteristics of high thermal conductivity, adjustable thermal expansion coefficient, low density, and moderate mechanical strength; their expansion coefficient is adjustable, which can be applied to the assembly requirements of circuit substrates of different materials inside; and their low density can greatly reduce The weight of the device is widely used in high-reliability integrated circuit packaging such as aviation and aerospace. [0003] Ho...

Claims

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Application Information

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IPC IPC(8): C23C28/02C23C18/32C23C18/18C25D5/12C25D3/12C25D3/48
CPCC23C28/021C23C18/32C23C18/1831C25D5/12C25D3/12C25D3/48
Inventor 徐东升于辰伟赵飞黄志刚杨磊
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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