Electromagnetic impedance sensing element and manufacturing method thereof

Abstract

The invention discloses an electromagnetic impedance sensing element and a manufacturing method thereof, wherein the electromagnetic impedance sensing element includes a base material, a first patterned conductive layer, a second patterned conductive layer, a magnetic wire and a cladding layer. The substrate has a surface and a groove extending from the surface into the substrate. The first patterned conductive layer is formed on the surface of the base material and the sidewall and bottom surface of the trench. Magnetic wires are located in the grooves. The second patterned conductive layer is formed on the first patterned conductive layer, across the trench and electrically contacted with the first patterned conductive layer, for sandwiching the magnetic wire between the first patterned conductive layer and the second pattern between conductive layers. The cladding layer covers the magnetic wires so as to electrically isolate the magnetic wires from the first patterned conductive layer and the second patterned conductive layer respectively. Wherein, the first patterned conductive layer and the second patterned conductive layer form at least one coil circuit surrounding the magnetic wire.

Description

technical field [0001] The invention relates to a semiconductor element and its manufacturing method, and in particular to an electromagnetic impedance sensing element and its manufacturing method. Background technique [0002] Due to the emergence of consumer electronic products such as mobile phones and electronic compasses, coupled with traditional products such as motors and brakes, the demand for electromagnetic impedance sensing devices is increasing. [0003] At present, most electromagnetic impedance sensing elements are based on ceramic substrates. The magnetic wires are fixed on the ceramic substrate through the interlaced stacking of multi-layer patterned conductive layers, patterned insulating layers and magnetic wires, and the magnetic wires are the center. , forming an induction coil circuit surrounding the magnetic wire. However, when forming the sensing coil circuit, every step of forming the patterned conductive layer and the patterned insulating layer must...

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Problems solved by technology

However, when forming the sensing coil circuit, the formation steps of each patterned conductive layer and patterned insulating layer must be aligned with the magnetic wires, and the manufacturing process is complicated and time-consuming

In addition, the magnetic wire is not easy to fix, and the height difference between the magnetic wire and the ceramic substrate will cause uneven coating of the photoresist used to pattern the conductive layer and insulating layer, which is prone to the problem of out-of-focus exposure and development , so that the yield rate is not easy to improve

In addition, since the conductive layer and the insulating layer will fluctuate with the shape of the magnetic wire, it is not conducive to the subsequent electrode pad (Pad) production, making it more difficult to further miniaturize the critical dimensions of the electromagnetic impedance sensing element, so that the number of coils cannot be reduced. increase, which hinders the improvement of the sensitivity of the electromagnetic impedance sensing element

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