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Solder paste for dipping as well as preparation technology and use method of solder paste

A preparation process and technology of solder paste, which is applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve problems such as insufficient strength, affecting product quality and reliability, and blockage of metal orifice plates to achieve cost savings and bonding The effect of high strength and consistency, simple preparation process

Inactive Publication Date: 2017-03-29
BEIJING ANDER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the brazing connection method has high requirements for the implementation of the process. The current brazing connection does not have an ideal solder paste and brazing method. It is prone to problems such as insufficient strength after the welding tongs and blockage of the metal orifice plate, which affects the quality of the product and the quality of the product. reliability

Method used

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  • Solder paste for dipping as well as preparation technology and use method of solder paste
  • Solder paste for dipping as well as preparation technology and use method of solder paste
  • Solder paste for dipping as well as preparation technology and use method of solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The solder paste for dipping, the components it contains and the respective parts by weight are as follows:

[0031] 5.7 parts of water-based binder

[0032] BN 2 63.6 parts of solder powder

[0033] 30.7 parts of water.

[0034] Metal and alloy powder wherein mainly adopt nickel base, copper base brazing material, adopt BNi in the present embodiment 2 Brazing filler metal powder, its main components are calculated by weight percentage: Cr 7.0%, B 3%, Si 4.5%, Fe3%, C 0.04%, P 0.01%, Ni balance. The brazing temperature of the solder powder is 1010-1175°C.

[0035] The average particle size of the metal and alloy powder in this embodiment is 140-325 mesh, wherein the water-based binder adopts Cememt 650 adhesive has a viscosity of 275-350CPS at 25°C, CPS is the viscosity unit, 1CPS=1mpa˙s.

Embodiment 2

[0037] The solder paste for dipping, the components it contains and the respective parts by weight are as follows:

[0038] 5 parts water-based binder

[0039] BN 2 Solder powder 50 parts

[0040] 20 parts of water.

[0041] Metal and alloy powder wherein mainly adopt nickel base, copper base brazing material, adopt BNi in the present embodiment 2 The brazing filler metal powder, its main composition by weight percentage is: Cr 6.0%, B 2.75%, Si 4.0%, Fe 2.5%, C 0.02%, P 0.015%, Ni balance. The brazing temperature of the solder powder is 1010-1175°C.

[0042] The average particle size of the metal and alloy powder in this embodiment is 140-325 mesh, wherein the water-based binder adopts Cememt 650 adhesive has a viscosity of 275-350 CPS at 25°C.

Embodiment 3

[0044] The solder paste for dipping, the components it contains and the respective parts by weight are as follows:

[0045] 10 parts of water-based adhesive

[0046] BN 2 Solder powder 75 parts

[0047] 40 parts of water.

[0048] Metal and alloy powder wherein mainly adopt nickel base, copper base brazing material, adopt BNi in the present embodiment 2 The brazing material powder, its main components are calculated by weight percentage: 8.0% Cr, 3.5% B, 5.0% Si, 3.5% Fe, 0.06% C, 0.02% P, Ni balance. The brazing temperature of the solder powder is 1010-1175°C.

[0049] The average particle size of the metal and alloy powder in this embodiment is 140-325 mesh, wherein the water-based binder adopts Cememt 650 adhesive has a viscosity of 275-350 CPS at 25°C.

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Abstract

The invention discloses solder paste for dipping. The solder paste is prepared from components in parts by weight as follows: 5-10 parts of a water-based binder, 50-75 parts of metal or alloy powder and 20-40 parts of water. A preparation technology of the solder paste comprises the steps as follows: the water-based binder, the metal or alloy powder and the water are weighed in parts by weight respectively; the water-based binder and the water are poured into a container and are evenly stirred; and the metal or alloy powder is added and is evenly stirred. A use method of the solder paste comprises the steps as follows: the solder paste with the certain height is placed in a container, and the surface of the solder paste is scraped flat; a to-be-soldered surface is dipped in the solder paste and is placed into a drying oven for drying or is air-dried naturally, and a to-be-soldered intermediate is obtained; and the to-be-soldered intermediate and a connecting piece are assembled, are soldered in a vacuum or furnace atmosphere and are connected into a whole. In the use process of the solder paste, holes are not blocked by solder, and the strength is high, uniform and consistent after soldering. The preparation technology is simple. With the adopted dipping method, the advantages of the solder paste can be exerted further.

Description

technical field [0001] The invention relates to the technical field of brazing, in particular to a solder paste for dipping, a preparation process and a use method thereof. Background technique [0002] Metal honeycomb panels are widely used in aircraft, trains, ships, construction and other fields due to their light weight, high strength, high rigidity, good stability, and heat and sound insulation. In recent years, the structure composed of metal honeycomb and metal orifice plate has been widely used in aircraft ground testing. The connection methods currently used in this structure mainly include adhesive connection and brazing connection. The adhesive connection method has been widely used because of its simple operation. However, its strength, service life and allowable working environment are largely affected by the properties of the adhesive, such as the uniformity of glue application, the blocking of the glue on the metal orifice plate, the aging of the glue, etc. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/40B23K1/08B23K1/008
CPCB23K1/008B23K1/08B23K35/025B23K35/304B23K35/40
Inventor 温盛发夏乔乔
Owner BEIJING ANDER TECH
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