Plasma processing equipment and cleaning system and method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- ADVANCED MICRO FAB EQUIP INC CHINA
- Publication Date
- 2017-03-29
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Abstract
Description
technical field
[0001] The invention relates to the field of plasma processing, in particular to a plasma processing device and its cleaning system and method. Background technique
[0002] Plasma processing equipment introduces reaction gas containing appropriate etchant or deposition source gas into the vacuum reaction chamber, and then applies radio frequency energy to the reaction chamber to dissociate the reaction gas to generate plasma, which is used to place Process the substrate surface in the reaction chamber.
[0003] Taking the plasma processing device for etching process as an example, such as figure 1 As shown, the first electrode is usually arranged at the shower head 30 for introducing reaction gas at the top of the reaction chamber 10, and the second electrode is arranged below the base 50 for carrying and holding the substrate at the bottom of the reaction chamber 10. Electrode, RF power is applied to the first electrode or the second electrode, so as to o...