Cooling device for carrying plate of pin measuring machine
A cooling device and carrier plate technology, which is applied in household refrigeration devices, semiconductor/solid-state device testing/measurement, lighting and heating equipment, etc., can solve the problems of dark cracking of wafer particles, easy reheating, and long time required to achieve Avoid the collision of the carrier plate, avoid the risk of fragmentation, and have a good cooling effect
Inactive Publication Date: 2017-04-12
ANHUI CHAOYUAN SEMICON CO LTD
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Problems solved by technology
However, using a hair dryer to cool down is easy to return to temperature, and it takes a long time to fully reach a stable normal temperature; using an external fan, it is easy for personnel to bump into the carrier plate during operation, causing the carrier plate to deform and affect the accuracy of the carrier plate; Dust or other particles are easy to remain on the disk, and the wafer encounters the risk of cracking or fragmentation when encountering particles during needle testing
Method used
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[0016] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.
[0017] During specific implementation, combined with figure 1 , a cooling device for a bearing plate of a needle measuring machine, comprising a fan 1, an air inlet pipe 2, a compressed air switch 3, a connecting pipe 5, an air inlet port 6, a hollow sealing device 7, and a bearing plate 8. The blower 1 is connected with the air inlet pipe 2 and the compressed air switch 3 in sequence, the air inlet port 6 is installed on the hollow sealing device 7 , and the compressed air switch 3 is connected with the air inlet port 6 through the connecting pipe 5 . An air outlet is opened on the lower surface of the hollow sealing device 7, and a carrier plate 8 is fixed below the air outlet.
[0018] In order to save energy, the fan adopts DC frequency con...
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The invention discloses a cooling device for a carrying plate of a pin measuring machine. The cooling device is composed of a fan, an intake pipe, a compressed air switch, an intake interface, a hollow sealing device, and a carrying plate. The fan is connected with the intake pipe and the compressed air switch successively; the intake interface is installed at the hollow sealing device; and the compressed air switch is connected with the intake interface by a connecting pipe. An air outlet hole is formed in the lower surface of the hollow sealing device; and the carrying plate is fixed below the air outlet hole. According to the cooling device, the fan, the intake pipe, the compressed air valve, the connecting pipe, the hollow sealing device form an external blowing device to carry out blowing and cooling on the carrying plate. The cooling device has characteristics of simple structure, convenience in usage, and good cooling effect. Any collision of the carrying plate during the cooling process can be avoided; the residual dust or other particles on the carrying plate of the pin measuring machine can be removed; and crack and fragment risks due to residual particles can be eliminated effectively.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing equipment, in particular to a cooling device for a bearing plate of a needle testing machine. Background technique [0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. The production and manufacture of semiconductors has formed a perfect production process in the continuous development. Generally, it is chip circuit design-wafer manufacturing-wafer testing-wafer cutting and grinding-chip packaging-finished chip testing. Wafer testing is to move the wafer from the worktable to under the test head of the needle tester, and press the pins on the probe card against the die to form a good electrical contact. In the semiconductor production and manufacturing process, wafer testing has different process requirements, and different processes have different test temperature r...
Claims
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IPC IPC(8): F25D1/00H01L21/66
CPCF25D1/00H01L22/14
Inventor 沈顺金
Owner ANHUI CHAOYUAN SEMICON CO LTD