Silicon chip feeding and calibrating device for photoetching machine and silicon chip feeding and calibrating method

Abstract

The invention discloses a silicon chip feeding and calibrating device for a photoetching machine and a silicon chip feeding and calibrating method. The silicon chip feeding and calibrating device can take silicon chips out from a silicon chip box one by one and then convey the silicon chips to a calibration station by using a first transmission rack and a second transmission rack alternately; then the silicon chip feeding and calibrating device carries out rapid calibration at the calibration station by using at least three circumference-calibrating through-beam sensors, a rough detection sensor and a fine detection sensor so as to ensure that the circle centers and gaps of the silicon chips are located at assigned positions; and a first transferring rack and a second transferring rack are alternately used for conveying the silicon chips to a photoetching station for photoetching so as to ensure accurate positioning and photoetching of the silicon chips having entered the photoetching station. The silicon chip feeding and calibrating device and the silicon chip feeding and calibrating method save time, improve efficiency and are accurate in calibration and high in calibration precision.

Description

technical field [0001] The invention relates to a feeding calibration device, which is used for feeding calibration of a silicon wafer of a photolithography machine to facilitate photolithography, and meanwhile, the invention also relates to a feeding calibration method of the photolithography machine. Background technique [0002] In the production process of integrated circuit chips, the exposure transfer (photolithography) of the design pattern of the chip on the photoresist on the surface of the silicon wafer is one of the most important processes. The equipment used in this process is called a photolithography machine (exposure machine). Lithography machine is the most critical equipment in the process of integrated circuit processing. When the lithography machine performs surface lithography on silicon wafers, it is necessary to take out the silicon wafers from the cassette one by one. At present, most of the silicon wafers are round in shape. Therefore, the silicon w...

AI Technical Summary

Problems solved by technology

When the lithography machine performs surface lithography on silicon wafers, it is necessary to take out the silicon wafers from the cassette one by one. At present, most of the silicon wafers are round in shape. Therefore, the silicon wafers only need to be directly fed into the lithography. The position is enough, but the shape of the silicon wafer has changed. In order to facilitate positioning, the edge of the circular silicon wafer is provided with a notch for positioning. One of the positioning notches is an arc-shaped notch. Due to the arc-shaped The existence of the gap requires the silicon wafer to enter the photolithography station in the specified direction to be accurately positioned. However, the current conveying device for the silicon wafer cannot accurately calibrate and position the silicon wafer. Lithography Requirements for Silicon Wafers

[0003] In addition, the feeding efficiency of the current silicon wafers is very low. After the silicon wafers are sent from the wafer pick-up station to the correction station by the silicon wafer conveying device for correction, the silicon wafer conveying device needs to be in the correction station to cooperate with the correction, and it also needs to wait for re-transportation The photolithographic silicon wafer, therefore, the transportation efficiency of the entire working silicon wafer conveying device is very low, and the waiting time is long, which in turn affects the photolithography efficiency of the entire silicon wafer

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