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Mechanical electronic product processing and packaging material

A packaging material and mechanical and electronic technology, applied in the field of mechanical and electronic products, can solve problems such as inability to meet production requirements, achieve the effect of material optimization and increase the refractive index

Inactive Publication Date: 2017-05-03
重庆韬华科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the processing of mechanical and electronic products, it is often necessary to use appropriate methods to package them. The general packaging treatment method cannot meet the production requirements. It is necessary to use appropriate methods to improve it in order to better achieve product packaging treatment effects.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The mechanical and electronic product processing packaging material in this embodiment is composed of the following components in parts by mass: 15 parts of silicon carbide, 6 parts of ethyl orthosilicate, 4 parts of white carbon black, and 18 parts of polyglycolic acid , 8 parts of sodium fluorosilicate and 3 parts of zinc acetylacetonate.

[0015] The above-mentioned encapsulation preparation method is as follows:

[0016] (1) Take the above-mentioned parts by mass of silicon carbide, ethyl orthosilicate, sodium fluorosilicate, and zinc acetylacetonate, and heat the four components of silicon carbide, ethyl orthosilicate, sodium fluorosilicate, and zinc acetylacetonate. After dissolving, stir until the mixture is uniform;

[0017] (2) Add silica and polyglycolic acid in the above-mentioned mass fractions, and stir evenly;

[0018] (3) defoaming the mixture in a vacuum defoaming machine, and the defoaming time is 3h;

[0019] (4) The mixture is then added into the m...

Embodiment 2

[0021] The mechanical and electronic product processing packaging material in this embodiment is composed of the following components in parts by mass: 17 parts of silicon carbide, 9 parts of ethyl orthosilicate, 6 parts of white carbon black, and 20 parts of polyglycolic acid , 9 parts of sodium fluorosilicate, and 4 parts of zinc acetylacetonate.

[0022] The above-mentioned encapsulation preparation method is as follows:

[0023] (1) Take the above-mentioned parts by mass of silicon carbide, ethyl orthosilicate, sodium fluorosilicate, and zinc acetylacetonate, and heat the four components of silicon carbide, ethyl orthosilicate, sodium fluorosilicate, and zinc acetylacetonate. After dissolving, stir until the mixture is uniform;

[0024] (2) Add silica and polyglycolic acid in the above-mentioned mass fractions, and stir evenly;

[0025] (3) defoaming the mixture in a vacuum defoaming machine, and the defoaming time is 3h;

[0026] (4) The mixture is then added into the ...

Embodiment 3

[0028] The mechanical and electronic product processing and packaging materials in this embodiment are composed of the following components in parts by mass: 19 parts of silicon carbide, 12 parts of ethyl orthosilicate, 8 parts of white carbon black, and 22 parts of polyglycolic acid , 10 parts of sodium fluorosilicate and 5 parts of zinc acetylacetonate.

[0029] The above-mentioned encapsulation preparation method is as follows:

[0030] (1) Take the above-mentioned parts by mass of silicon carbide, ethyl orthosilicate, sodium fluorosilicate, and zinc acetylacetonate, and heat the four components of silicon carbide, ethyl orthosilicate, sodium fluorosilicate, and zinc acetylacetonate. After dissolving, stir until the mixture is uniform;

[0031] (2) Add the above-mentioned mass fraction of white carbon black and polyglycolic acid, and stir evenly;

[0032] (3) defoaming the mixture in a vacuum defoaming machine, and the defoaming time is 3h;

[0033] (4) The mixture is th...

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PUM

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Abstract

The invention relates to a mechanical electronic product processing and packaging material. The mechanical electronic product processing and packaging material is composed of, by mass, 15 to 19 parts of silicon carbide, 6 to 12 parts of tetraethyl orthosilicate, 4 to 8 parts of white carbon black, 18 to 22 parts of polyglycolic acid, 8 to 10 parts of sodium fluosilicate, and 3 to 5 parts of zinc acetylacetonate. The mechanical electronic product processing and packaging material is capable of increasing the refractive index, hardness, and bonding strength of mechanical electronic products obviously via optimization of mechanical electronic products.

Description

technical field [0001] The invention relates to a processing and packaging material for mechanical and electronic products, and belongs to the technical field of mechanical and electronic products. Background technique [0002] In the process of processing mechanical and electronic products, it is often necessary to package them in a suitable way. The general packaging and processing methods cannot meet the production requirements, and it is necessary to use suitable methods to improve them in order to better achieve the effect of product packaging and processing. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a processing and packaging material for mechanical and electronic products, so as to better encapsulate the mechanical and electronic products and improve the use effect of the mechanical and electronic products. [0004] In order to achieve the above objects, the technical solutions of the present invention are as follows. [0...

Claims

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Application Information

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IPC IPC(8): C08L67/04C08K13/02C08K3/34C08K5/5415C08K3/36C08K5/07
Inventor 汪新华
Owner 重庆韬华科技有限公司