Wafer discharging method, wafer discharging auxiliary device, wafer discharging device and CMP equipment comprising wafer discharging device

Abstract

The invention discloses a wafer discharging method, auxiliary device and device, and CMP equipment comprising the wafer discharging device. The wafer discharging method comprises the following steps of conveying a wafer to the position above a discharge surface; releasing the wafer to enable the wafer to move towards the discharge surface; spraying liquid to the lower surface of the wafer in the moving process of the wafer to provide buffering force for the moving wafer. According to the wafer discharging method provided by the embodiment of the invention, the wafer can be prevented from being scratched and broken during wafer discharging; accordingly, the yield of wafers can be increased, the productivity and efficiency can be improved, the frequency of shutdown maintenance can be reduced, and the cost can be lowered.

Description

technical field [0001] The present invention relates to the technical field of chemical machinery, more specifically, to a wafer unloading method, a wafer unloading auxiliary device, a wafer unloading device and a CMP with a wafer unloading device equipment. Background technique [0002] In the semiconductor integrated circuit chip manufacturing process, planarization technology has become one of the indispensable key technologies that are equally important and interdependent with photolithography and etching. The chemical mechanical polishing (CMP) process is currently the most effective and mature planarization technology. The chemical mechanical polishing system is a chemical mechanical planarization technology integrating polishing, cleaning, drying, online detection, end point detection and other technologies. CMP equipment is fully automated and does not require manual operation to ensure the safety of each module and link in the production process of the wafer. It i...

AI Technical Summary

Problems solved by technology

Once a wafer is scratched or broken, the machine must be shut down for cleaning, consumables must be replaced and maintenance and testing will be performed, which will result in the loss of damaged wafers. At the same time, the production capacity and efficiency will be reduced. Normal production and production profits have a great impact

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