A metal bonded diamond grinding wheel

A metal bond and diamond technology, used in metal processing equipment, abrasives, grinding devices, etc., can solve the problems of poor impact resistance and fatigue performance, low bonding strength holding force, difficult to apply to high-speed processing, etc. The effect of high precision, short sintering time and good thermal conductivity

A metal bond and diamond technology, used in metal processing equipment, abrasives, grinding devices, etc., can solve the problems of poor impact resistance and fatigue performance, low bonding strength holding force, difficult to apply to high-speed processing, etc. The effect of high precision, short sintering time and good thermal conductivity

CN106625296BActive Publication Date: 2018-07-03磐维科技(青岛)有限公司
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The metal bond of this embodiment is composed of the following raw material components in mass percentage: Cu 55%, Sn 37%, TiH 2 8%; the sum of the mass fractions of each component is 100%; the above-mentioned raw materials are Cu powder, Sn powder and TiH2 powder; the particle size of the above-mentioned raw material powders is 20 μm.

[0023] A metal-bonded diamond grinding wheel and a preparation method thereof in this embodiment are made of the following raw materials in mass percentages: 50% diamond abrasive, 44% metal-bonded powder, and 6% auxiliary binder. The particle diameter of the above-mentioned diamond abrasive is 10 μm.

[0024] The preparation method of above-mentioned a kind of metal bond diamond grinding wheel and preparation method thereof is as follows:

[0025] (1) Mixing: Put diamond abrasive, Cu powder, Sn powder and TiH2 powder into the mixer according to the formula, add auxiliary binder and mix for 4 hours to obtain the mixture;

[0026] (2) D...

Embodiment 2

[0031] The metal bond of this embodiment is composed of the following raw material components in mass percentage: Cu 50%, Sn 44%, TiH 2 6%; the sum of the mass fractions of each component is 100%; the above-mentioned raw materials are Cu powder, Sn powder and TiH2 powder; the particle size of the above-mentioned raw material powders is 80 μm.

[0032] A metal-bonded diamond grinding wheel and a preparation method thereof in this embodiment are made of the following raw materials in mass percentage: 33% of diamond abrasive, 62% of metal-bonded powder, and 5% of auxiliary binder. The particle diameter of the above-mentioned diamond abrasive is 60 μm.

[0033] The preparation process of a metal bond diamond grinding wheel and its preparation method is as follows:

[0034] (1) Mixing: Put diamond abrasive, Cu powder, Sn powder and TiH2 powder into the mixer according to the formula, add auxiliary binder and mix for 4 hours to obtain the mixture;

[0035] (2) Drying: Put the unif...

Embodiment 3

[0040] The metal bond of this embodiment is composed of the following raw material components in mass percentage: Cu 54%, Sn 31%, TiH 2 15%; the sum of the mass fractions of each component is 100%; the above-mentioned raw materials are Cu powder, Sn powder and TiH2 powder; the particle size of the above-mentioned raw material powders is 150 μm.

[0041] A metal-bonded diamond grinding wheel and a preparation method thereof in this embodiment are made of the following raw materials in mass percentages: 25% diamond abrasive, 72% metal-bonded powder, and 3% auxiliary binder. The particle diameter of the above-mentioned diamond abrasive is 150 μm.

[0042] The preparation process of a metal bond diamond grinding wheel and its preparation method is as follows:

[0043] (1) Mixing: Put diamond abrasive, Cu powder, Sn powder and TiH2 powder into the mixer according to the formula, add auxiliary binder and mix for 4 hours to obtain the mixture;

[0044] (2) Drying: Put the uniforml...

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Abstract

The invention relates to the field of superhard materials, in particular to a diamond grinding wheel which is excellent in impact resistance and shape retention, can bear higher load during a high-speed grind process, and comprises a steel core and an abrasive material ring adhered together through a resin adhesive; the abrasive material ring is characterized by being prepared from the following raw materials in mass percent: 25-50% of diamond abrasive material, 44-72% of a metallic bond and 3-6% of an auxiliary adhesive. The diamond grinding wheel has excellent heat conductivity to facilitate reduction of grinding temperature so as to reduce power loss and increase grinding speed; the auxiliary adhesive in the formula facilitates formation of pores, and the characteristic of high holding force of the metallic bond is combined, so that the chip space can be effectively increased, and the utilization of the abrasive material is more sufficient; and the grinding wheel has the characteristics of high grinding efficiency, low grinding temperature and power loss, high machining precision and long service life.

Description

technical field [0001] The invention relates to the field of superhard materials, in particular to a metal-bonded diamond grinding wheel and a preparation method thereof. Background technique [0002] Modern machining is developing in the direction of high precision, high speed, hard machining, dry machining (no coolant) and cost reduction, which puts forward quite high requirements for the performance of superhard abrasive tools. Currently commonly used superhard grinding materials include cubic boron nitride (CBN) and diamond abrasives. Although the hardness of CBN abrasive is inferior to that of diamond, its thermal stability and chemical stability are strong, especially it will not react with iron and iron alloys, so it can be used in iron-based alloy materials such as hardened steel, high-speed tool steel, bearing steel, stainless steel, It has been widely used in the grinding of many high-strength toughness difficult-to-machine materials such as die steel, heat-resist...

Claims

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Application Information

Patent Timeline
03 Jul 2018
Publication
CN106625296B
IPC
B24D3/10; B24D3/34; B24D18/00
CPC
B24D3/10; B24D3/342; B24D18/0009
Inventors
姚佳昊; 李培亮