Resin composition and application thereof

Abstract

The invention relates to a resin composition and application thereof, in particular to high-performance prepreg with high frequency, packaging, high-density interconnection and the like, metal foil clad laminated boards and interlayer insulating film. The resin composition is prepared from, by weight, 100 parts of epoxy resin, 1-80 parts of active ester, 1-60 parts of cyanate ester and 0.001-5 parts of curing accelerator; the structure formula of the active ester is I or II or the combination of I or II. (The structure formula is shown in the description.) The invention further relates to high-performance prepreg, metal foil clad laminated boards and interlayer insulating film made of the resin composition. The provided condensate prepared from resin composition can obtain a low dielectric constant and dielectric loss tangent value, high heat resistance and excellent adhesion, resistance to heat and humidity, toughness, rigidity and processability.

Description

technical field [0001] The invention relates to a resin composition and its application, especially a high-performance prepreg for high-frequency, packaging, and high-density interconnection, a metal-foil-clad laminate, and an interlayer insulation film. Background technique [0002] In recent years, information terminals such as personal computers and servers, and communication equipment such as Internet routers and optical communications process large-capacity information at high speeds, and the high-speed and high-frequency electrical signals are advancing. The integrity of high-speed high-frequency products is the focus of attention. Therefore, expect to provide a kind of thermosetting resin composition, the printed circuit board material that uses this thermosetting resin composition to make can show sufficiently low low dielectric constant and low dielectric constant in the high-speed, high-frequency signal transmission process. loss tangent. [0003] In the prior ar...

AI Technical Summary

Problems solved by technology

Although benzoxazine resin has a high glass transition temperature (Tg) and good mechanical properties, its crosslinking density is relatively low, so the cured product is brittle.

[0006] Patent JP2011132507A discloses an epoxy resin active ester resin system in which triazine phenolic novolak novolac resin is added. Although the adhesiveness of the cured product can be improved in this patent, the cured product of the triazine phenolic novolac novolak resin High water absorption, it is difficult to meet the moisture and heat resistance requirements of high-performance sheets

In the patent CN102443138A, naphthol-type epoxy resin is added to the active ester resin to improve the heat resistance, rigidity and moisture resistance of the cured product, but those skilled in the art know that the naphthalene-type epoxy resin is not only expensive, but also the naphthalene group molecules The rigidity of the skeleton is

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