Semiconductor device welding mechanism

Abstract

The invention discloses a semiconductor device welding mechanism, and belongs to the field of semiconductor device welding equipment. The semiconductor device welding mechanism is characterized in that a heating mechanism (7) is arranged on a rack (6), the heating mechanism (7) comprises a plurality of heating plates paved on the rack (6) side by side, and a semiconductor device (11) is independently placed on the top surface of each heating plate respectively; a lifting moving mechanism (3) is further arranged on the rack (6), and the lifting moving mechanism (3) is used for lifting the semiconductor devices (11) from one heating plate and then simultaneously driving the semiconductor devices (11) to horizontally move to the next heating plate. The semiconductor device welding mechanism changes a traditional heating manner, a heating mode during contacting is adopted, contact heating is realized directly through the contact between the semiconductor and the heating surface of the heating mechanism, the disadvantage of non-uniform heating existing in traditional tunnel kiln type heating is avoided, the heating mechanism comprises a plurality of heating plates paved on the top of the rack side by side, and the semiconductor devices are directly moved and conveyed without moving the heating plates.

Description

technical field [0001] A semiconductor device welding mechanism belongs to the field of semiconductor device welding equipment. Background technique [0002] With the development of modern technology, semiconductor devices and components have been widely used in engineering and business. Its extensive applications in radar, remote control telemetry, aerospace, etc. put forward higher and higher requirements for its reliability. The failure caused by poor chip welding (pasting) has attracted more and more people's attention, because this failure is often fatal and irreversible. [0003] When assembling a semiconductor device, heat and fix the circuit part and the peripheral case with an adhesive, and then connect the terminal part formed on the peripheral case and the insulating substrate by soldering with solder paste (solder) The process of wiring. When bonding the circuit part and the peripheral case, apply the adhesive to the circuit part or the peripheral case, and he...

AI Technical Summary

Problems solved by technology

However, the applicant found that most of the current soldering boards have a one-piece structure, and one side or the upper part of the soldering board is provided with a heating wire or a heating tube. The heating surface formed by this structure is not uniform enough, and the heating effect is not good, which affects the semiconductor device. welding effect; moreover, the transportation of semiconductor devices between each process is mostly manual or equipment clamping, which is easy to damage the surface of semiconductor devices or cause certain damage to the human body

Images