Masks for laser processing
A laser processing and masking technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of reduced oscillation output, unstable laser oscillation, and degradation of laser mode, so as to prevent mode degradation and oscillation output the reduced effect of
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Embodiment 1
[0028] figure 1 It is a schematic diagram which shows an example of the laser processing apparatus which used the mask concerning this invention. The laser processing apparatus 1 includes a laser oscillator 10 that is a laser light source, a lens 20 , a damper 30 , and a mask 40 , and laser light L2 that has passed through the mask 40 is irradiated to a not-shown workpiece. In addition, a mirror surface, a focusing lens, and the like can be appropriately disposed in the middle of the optical axis of the laser light L. For example, using UV laser, YAG laser, CO 2 Any laser light such as a laser light is used as the laser light L.
[0029] The mask 40 of this embodiment has figure 2 The illustrated cylindrical mask main body 41 has a pin hole 42 having a circular cross section penetratingly formed in the central portion thereof. In addition, the cross-sectional shape of the pin hole 42 is not limited to a circle. The orientation of the mask main body 41 is set so that the...
Embodiment 2
[0041] Figure 5 Example 2 of the mask according to the present invention is shown. The mask 45 of this embodiment is formed in a pyramid shape having four inclined surfaces 46 on which grooves or concavities and convexities 46a parallel to the direction of inclination are formed. Therefore, the surface roughness Ray in the direction parallel to the inclined direction is smaller than the surface roughness Rax in the direction perpendicular to the inclined direction. In addition, although the pin hole 47 which consists of an oblique hole is formed in the center part of the mask 45, a circular hole may also be formed.
[0042] In this case, since the surface roughness Ray in the direction parallel to the inclined direction of the inclined surface 46 is smaller than the surface roughness Rax in the direction perpendicular to the inclined direction, the laser beam incident on the inclined surface 46 diverges in various directions, and the reflected light can be suppressed. It be...
Embodiment 3
[0044] Figure 6 Example 3 of the mask according to the present invention is shown. The mask 48 of this embodiment is formed in a conical shape having one tapered surface 49 on which radial grooves or concavities and convexities 49a parallel to the direction of inclination are formed. Therefore, the surface roughness Ray in the direction parallel to the inclined direction is smaller than the surface roughness Rax in the direction perpendicular to the inclined direction. In addition, although the pin hole 50 which consists of a circular hole is formed in the center part of the mask 48, you may form an oblique hole.
[0045] Figure 6 The case of mask 48 is also used with Figure 5 Similarly, the surface roughness Ray in the direction parallel to the inclined direction in the tapered surface 49 is smaller than the surface roughness Rax in the direction perpendicular to the inclined direction, so the laser light incident on the tapered surface 49 diverges in various directions...
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Abstract
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