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Electrostatic chuck device

An electrostatic chuck and electrostatic adsorption technology, which is applied to the application of electrostatic attraction holding devices, positioning devices, circuits, etc., can solve the problems of thermal conductivity changes and the inability to control the plate-shaped sample at the specified temperature, etc., to achieve stable temperature control , the effect of changing the reduction

Active Publication Date: 2019-03-15
SUMITOMO OSAKA CEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the conventional electrostatic chuck device has the following problems: the heat conduction between the protrusion and the plate-shaped sample gradually changes with wear, and the plate-shaped sample cannot be controlled at a predetermined temperature under the same gas pressure.

Method used

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  • Electrostatic chuck device
  • Electrostatic chuck device
  • Electrostatic chuck device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0163] Hereinafter, examples are shown to illustrate the present invention in further detail, but the present invention is not limited to these examples.

[0164] First, the electrostatic chuck part 2 in which the projection part 30 is not formed in the mounting surface 19 was manufactured by the conventional method.

[0165] The electrostatic chuck part 2 has an internal electrode 13 for electrostatic adsorption with a thickness of about 10 μm embedded therein. The mounting plate 11 of the electrostatic chuck portion 2 is an alumina-silicon carbide composite sintered body containing 7.8% by mass of silicon carbide, and has a disc shape with a diameter of 298 mm and a thickness of 0.5 mm.

[0166] Also, like the mounting plate 11, the support plate 12 is also an alumina-silicon carbide composite sintered body containing 7.8% by mass of silicon carbide, and has a disc shape with a diameter of 298 mm and a thickness of 2 mm. By joining these mounting plate 11 and support plate 12 to b...

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PUM

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Abstract

The present invention provides an electrostatic chuck device, which absorbs a plate-shaped sample by an electrode for electrostatic adsorption, and cools the plate-shaped sample. The electrostatic chuck device has an electrostatic chuck part, and the electrostatic chuck part is The ceramic sintered body is a forming material, and one main surface of the electrostatic chuck part is a mounting surface on which a plate-shaped sample is placed, and a plurality of protrusions for supporting the plate-shaped sample are provided on the mounting surface, and the protrusions are on the top. The surface is in contact with the plate-shaped sample and supports the plate-shaped sample, and the cross-sectional area increases downward from the height of the top surface. The cross-sectional area of ​​the lower end is 110% or less.

Description

Technical field [0001] The invention relates to an electrostatic chuck device. [0002] This application claims priority based on Japanese Patent Application No. 2014-201304 filed in Japan on September 30, 2014, and uses the content in this specification. Background technique [0003] In recent years, in the semiconductor manufacturing process, with the high integration and high performance of components, it is required to further improve the micro processing technology. In the semiconductor manufacturing process, etching technology is also one of the important technologies of micro processing technology. In recent years, plasma etching technology, which can efficiently and large area micro processing, has also become the mainstream in etching technology. [0004] Conventionally, in a semiconductor manufacturing apparatus using plasma such as a plasma etching apparatus, an electrostatic chuck apparatus is used as an apparatus that simply mounts and fixes a wafer on a sample stage an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/3065H02N13/00
CPCH01L21/3065H01L21/6831H01L21/6875B23Q3/15H01L21/6833H02N13/00H01L21/67103
Inventor 河野仁牛坊文洋
Owner SUMITOMO OSAKA CEMENT CO LTD