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Apparatus and methods for performing laser ablation on a substrate

A technology of laser ablation and equipment, used in laser welding equipment, lasers, welding equipment, etc., can solve problems such as limited inflexibility, and achieve the effect of reducing costs and increasing production

Inactive Publication Date: 2017-05-10
M SOLV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This approach avoids the need for expensive excimer lasers, but is still limited by inflexibility related to the use of masks

Method used

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  • Apparatus and methods for performing laser ablation on a substrate
  • Apparatus and methods for performing laser ablation on a substrate
  • Apparatus and methods for performing laser ablation on a substrate

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Embodiment Construction

[0040] figure 1 A cross-section of a high density interconnect (HDI) printed circuit board (PCB) or integrated circuit (IC) substrate is shown and shows the type of "embedded" structure that needs to be formed. On a dielectric core layer 2 is supported a copper layer 1 patterned to form a circuit. The copper layer 1 is coated with an upper dielectric layer 3 in which various structures are formed by laser ablation. The grooves 4, 4' and 4", the large pad 5 and the small pad 6 and the small pad 7 all have the same depth, which is less than the overall thickness of the upper dielectric layer 3. For the IC substrate, the required groove The width and pad diameter are usually in the range of 5 microns to 15 microns and 100 microns to 300 microns, respectively, and the depth is in the range of 5 microns to 10 microns. For HDI PCB, the groove can be wider and deeper. By laser ablation in the solder A deeper contact hole (or via) 8 is formed in the pad 7, removing all upper dielect...

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Abstract

Apparatus and methods are disclosed for performing laser ablation. In an example arrangement a spatial light modulator (54) is used to modulate a pulsed laser beam from a solid state laser (52). A two-stage de-magnification process (58, 62) is used to allow radiation intensity to be kept relatively low at the spatial light modulator (54) while allowing access to feedback sensors (64) in an intermediate imaging plane.

Description

technical field [0001] The present invention relates to laser ablation on substrates using solid state lasers and programmable spatial light modulators. Background technique [0002] Lasers are widely used in the manufacture of advanced printed circuit boards (PCBs). A very familiar example is punching contact blind holes (known as microvias) in multilayer PCBs. In this case, an ultraviolet (UV) solid-state laser is typically used to punch through the top copper layer and the underlying dielectric layer, thereby enabling access to the lower copper layer. In some cases, the cost-effectiveness of the process is improved by using two different laser processes to remove two different materials. Holes are usually drilled in the top copper layer using a UV diode-pumped solid-state (DPSS) laser to expose the lower dielectric layer, and in a separate process, a CO2 laser is used to remove the exposed dielectric material beneath each hole. [0003] A new type of high-density multi...

Claims

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Application Information

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IPC IPC(8): H05K3/00B23K26/06B23K26/38
CPCB23K26/0643B23K26/0648B23K26/082B23K26/389H05K3/0035H05K3/0038H05K2203/107B23K2101/42H05K3/0032H05K3/465H05K2203/163B23K26/02B23K26/064B23K26/361H01S3/00H05K3/0026B23K26/386
Inventor D·C·米尔恩P·T·路姆斯比大卫·托马斯·埃德蒙·迈尔斯
Owner M SOLV