A photolithographic plate automatic feeding and unloading device for a chip photolithography machine

Abstract

The invention discloses a photolithography plate automatic feeding and retrieving device of a chip photolithography machine, which comprises a machine base, a lifting seat is installed on the machine base for vertical lifting, a horizontal base is installed on the lifting seat, and a horizontal base is installed on the horizontal base. The material retrieving mechanism, the material retrieving mechanism includes a support, and the first suction plate and the second suction plate are slidably installed on the support. The sliding direction of the first suction plate and the second suction plate is the same and perpendicular to the sliding direction of the horizontal base. The support is provided with a synchronous opening and closing mechanism, and both the first suction plate and the second suction plate are provided with a negative pressure suction port, which corresponds to the edge of the lower plate surface of the photolithography plate, and the first suction plate Or the second suction plate is driven by the opening and closing power device, and the opposite sides of the first suction plate and the second suction plate are provided with avoidance notches. The automatic feeding and retrieving device enters and directly absorbs the photoresist plate from both sides of the photoresist plate through the opening and closing of the first suction plate and the second suction plate, and the first suction plate and the second suction plate do not contact the plate film, thereby Abrasion or tearing of the plate film is avoided.

Description

technical field [0001] The invention relates to an automatic feeding and retrieving device, in particular to an automatic feeding and retrieving device for a photolithography plate of a chip photolithography machine. Background technique [0002] In the production process of integrated circuit chips, the exposure transfer (photolithography) of the design pattern of the chip on the photoresist on the surface of the silicon wafer is one of the most important processes. The equipment used in this process is called a photolithography machine (exposure machine). Lithography machine is the most critical equipment in the process of integrated circuit processing. [0003] However, during the photolithography process, the photoresist plate needs to be sent to the photoresist plate adsorption base by an automatic retrieving device or the photoresist plate on the photoresist plate adsorption base is taken away. It is only suitable for glossy photolithography plates. The current autom...

AI Technical Summary

Problems solved by technology

However, due to the improvement and improvement of the photolithography process, the upper and lower surfaces of the photolithography plate will be bonded with the plate film, which is thin and easy to wear and tear. For the lithography plate of the film, when the insertion plate is inserted under the lithography plate to take the material, it is easy to contact the surface or edge of the plate film and cause the plate film to wear or tear, so that it cannot meet the subsequent lithography requirements

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