High stability white light LED packaging method and high stability white light LED packaging structure

A technology of LED packaging and high stability, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., and can solve problems such as drift, large heat generation of LED chips, and attenuation of color

Inactive Publication Date: 2017-05-24
广东中晶激光照明技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, the traditional white LED packaging is a packaging structure in which glue and phosphor are mixed. The disadvantage is that attenuation and color drift will occur when the chip generates high heat, especially when the traditional LED packaging structure is used as an LED car. In the case of headlights, projection light sources or high-power light sources above 100 watts, due to the need to ensure sufficient high power for long-term continuous use, the heat generated by the LED chip is extremely high, which will cause rapid aging of the glue and phosphor. Seriously affect the life and light efficiency of the product

Method used

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  • High stability white light LED packaging method and high stability white light LED packaging structure

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Embodiment Construction

[0032] Such as figure 1 As shown, it is a high-stability white LED packaging structure according to the present invention, which includes an LED chip 2 fixed on a substrate 1 and a light conversion medium 3 covering the light-emitting surface of the LED chip 2, and the light emitted by the LED chip 2 After passing through the light conversion medium 3, the light is converted to obtain highly stable white light. Further, the optimal wavelength of light emitted by the LED chip is between 420-470nm. The LED chip adopts a flip chip or a vertical chip; the LED chip is connected in series, parallel or series-parallel; the LED chip is fixed on the substrate by flip chip, front mounting or eutectic welding, and the material of the substrate is Any of ALN (aluminum nitride), aluminum oxide, a copper substrate, or an aluminum substrate may be used.

[0033] The light conversion medium is any one of glass, transparent ceramics, and single crystals; the light conversion medium described...

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Abstract

The invention belongs to the illumination technology field, and relates to a high stability white light LED packaging method and a high stability white light LED packaging structure, to be specific, relates to high power density LED light source packaging and ultrahigh power LED light source packaging. The high stability white light LED packaging structure is different from a conventional packaging structure adopting a way of mixing glue and phosphor together, and according to the conventional packaging structure, when high heat energy is generated by a chip, attenuation and color drift can be caused. By adopting the method provided by the invention, glass, ceramics, and single crystal after high temperature processing are disposed on the surface of the chip in a covered manner, and the color changing and the color drift under the high temperature condition are prevented, and therefore the method and the structure are suitable for LED vehicle headlamps, projection light sources, and high power light sources above 100watt.

Description

technical field [0001] The invention belongs to the technical field of lighting, and in particular relates to a white light LED packaging method, packaging structure and application in the field of high-power light sources. Background technique [0002] At present, the traditional white LED packaging is a packaging structure in which glue and phosphor are mixed. The disadvantage is that attenuation and color drift will occur when the chip generates high heat, especially when the traditional LED packaging structure is used as an LED car. In the case of headlights, projection light sources or high-power light sources above 100 watts, due to the need to ensure sufficient high power for long-term continuous use, the heat generated by the LED chip is extremely high, which will cause rapid aging of the glue and phosphor. Seriously affect the life and light efficiency of the product. Contents of the invention [0003] The technical problem to be solved by the present invention i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
CPCH01L33/00H01L33/50H01L33/52H01L33/505H01L2933/0041
Inventor 夏泽强
Owner 广东中晶激光照明技术有限公司
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