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Millimeter-wave monolithically integrated transmitting power distribution circuit

A single-chip integration and transmission power technology, applied in the field of circuits, can solve the problems of large millimeter-wave chips, increased parasitic effects, multi-chip area, etc., to achieve compact layout, reduce parasitic loss, and occupy a small chip area Effect

Active Publication Date: 2017-05-24
麦堆微电子技术(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing millimeter-wave transmission power distribution circuits all use multiple sets of one-to-two power dividers to achieve three-way power distribution, which requires a large chip area and increases parasitic effects, making the millimeter-wave chip larger. , the power consumption is also relatively high

Method used

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  • Millimeter-wave monolithically integrated transmitting power distribution circuit

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Embodiment Construction

[0010] The embodiments of the present invention are described in further detail below in conjunction with the accompanying drawings, but the present embodiments are not intended to limit the present invention. All similar structures and similar changes of the present invention should be included in the scope of protection of the present invention. The commas in all indicate the relationship between and.

[0011] Such as figure 1 As shown, a millimeter-wave single-chip integrated transmission power distribution circuit provided by the embodiment of the present invention is characterized in that it includes a one-to-three-way power divider, a first-stage drive amplifier, a second-stage drive amplifier, a power amplifier, A frequency divider, and a polyphase filter for generating four quadrature differential signals;

[0012] The source signal input terminal of the one-point three-way power splitter is connected to the output end of the first-stage drive amplifier, and the first...

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Abstract

The invention provides a millimeter-wave monolithically integrated transmitting power distribution circuit, relating to the technical field of circuits. According to the distribution circuit, the occupied area, the parasitic effect and the power consumption are reduced. The distribution circuit comprises a three-route-dividing power divider, a first-stage driving amplifier, a second-stage driving amplifier, a power amplifier, a frequency divider and a multi-phase filter, wherein the multi-phase filter is used for generating four routes of orthogonal differential signals; and an source signal input end of the three-route-dividing power divider is connected to the output end of the first-stage driving amplifier, a first-route output end of the three-route-dividing power divider is connected to the input end of the multi-phase filter through the second-stage driving amplifier, a second-route output end of the three-route-dividing power divider is connected to the input end of the power amplifier, and a third-route output end of the three-route-dividing power divider is connected to a source signal input end of the frequency divider. According to the distribution circuit provided by the invention, the parasitic effect is reduced, the occupied area of a chip is small, and the power consumption is low.

Description

technical field [0001] The invention relates to circuit technology, in particular to a millimeter-wave single-chip integrated transmission power distribution circuit technology. Background technique [0002] Because the millimeter-wave frequency band has a high available bandwidth and high detection accuracy, millimeter-wave chips are widely used in wireless communication, radar, guidance, remote sensing technology, radio astronomy, and electronic countermeasures. In recent years, with the successive opening up of millimeter wave frequency bands, millimeter wave chips have become a hot spot. Among them, the millimeter-wave RF front-end, as a key technology, largely determines the performance, cost, and size of the system. [0003] In recent years, as the market's demand for millimeter-wave chips has increased, the requirements for its cost, integration, and power consumption have increased. The progress of the integrated circuit technology, especially the CMOS technology, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/04
CPCH04B1/04H04B2001/0408
Inventor 田彤丁博文赵辰袁圣越沈叶东
Owner 麦堆微电子技术(上海)有限公司
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