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Laser encapsulation method in additive and subtractive composite manufacturing

A laser packaging and additive manufacturing technology, applied in manufacturing tools, laser welding equipment, metal processing equipment, etc., can solve problems such as poor surface finish, low forming accuracy, and low resolution, and achieve the effect of solving powder residues

Active Publication Date: 2019-09-06
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Selective laser melting technology can realize the forming of complex structural parts, but the forming precision is low, the surface finish is poor, and the resolution is low. Generally, follow-up processing is required to improve the surface finish.

Method used

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  • Laser encapsulation method in additive and subtractive composite manufacturing
  • Laser encapsulation method in additive and subtractive composite manufacturing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The present embodiment will be described in detail below with reference to the accompanying drawings. The laser packaging process in the additive and subtractive composite manufacturing of this application is as follows figure 1 shown, where:

[0037] Step S1: The matrix is ​​obtained by using the additive manufacturing method of selective laser melting (SLM), wherein the laser beam I is a 1064nm infrared continuous wave laser.

[0038] Step S2: Processing on the substrate shaped in step S1 with a pulsed laser figure 1 The groove structure shown in S2 ( figure 1 The microchannel region shown in S2) and the concave edge structure, and the surface is laser polished and finished to improve the smoothness of the wall and bottom surfaces, wherein the laser beam II is a 532nm picosecond green laser.

[0039] Step S3: using a tool with holes on the edge, a pneumatic grabbing device in the center of the tool, which can grab and put down the prefabricated panel, and the tool ...

Embodiment 2

[0048] The operation is the same as in Example 1, except that the edge of the tooling is a circular hole, the hole spacing is 0.01 mm, and the thickness of the thin-walled metal is 0.1 mm. figure 1 The surface of the thin-walled metal after welding in step S5 is smooth and without deformation.

Embodiment 3

[0050] The operation is the same as in embodiment 1, except that the edge of the tooling is an oval hole, the hole spacing is 0.4 mm, and the thickness of the thin-walled metal is 1 mm. figure 1 The surface of the thin-walled metal after welding in step S5 is smooth and without deformation.

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Abstract

The invention discloses a laser packaging method for additive and subtractive composite manufacturing. Through the laser packaging method, high-quality welding of thin-wall metal and a base material is achieved, on the basis of selective laser melting, the problems of forming of a micro-channel inside the material, especially, forming of an overhang face and remaining of powder in the micro-channel are solved with the precise laser packaging method, and the requirements for high precision, high smooth finish and high cleanliness of machining of aerospace key components are met. According to the laser packaging method, a precast slab covers the downwards concave structure of a base body through a tool, welding is conducted on the edge of the precast slab through lasers so that packaging of the area of the downwards concave structure of the base body can be completed.

Description

technical field [0001] The application relates to a laser encapsulation method for materials in additive and subtractive material composite manufacturing, which belongs to the field of material laser forming. Background technique [0002] Selective laser melting technology can realize the forming of complex structural parts, but the forming precision is low, the surface finish is poor, and the resolution is low. Generally, follow-up processing is required to improve the surface finish. Introducing ultra-fast laser material subtraction and laser precision packaging technology into laser additive manufacturing can realize the precise forming and processing of microchannels in complex inner cavity structures, and at the same time solve the problems of overhanging surface forming and microchannel powder residues. It meets the requirements of high precision, high finish and high cleanliness for the processing of key aerospace parts. In the link of additive and subtractive materi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/20B23K26/22
Inventor 焦俊科张文武
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI