Synthesis of polyamide modified phenolic aldehyde resin
A technology of phenolic resin and polyamide, applied in the direction of aldehyde/ketone condensation polymer adhesives, adhesive types, adhesives, etc., can solve the problems that the refractive index affects the contrast and clarity of flat-panel displays, and achieve good application value, Good resistance to yellowing, easy to control the effect
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Embodiment 1
[0008] Accurately weigh 150g of polyamide-modified phenolic resin, 8g of n-hexanol, 0.1g of polymerization inhibitor p-hydroxyanisole, and 0.01g of catalyst butyl titanate, add them into a three-necked flask with a thermometer, raise the temperature to 65 degrees, and start Add 22g of diisocyanate IPDI dropwise, control the temperature at 75°C, and react for 5h. The content of NCO group was analyzed by infrared spectrometer, and when the peak of NCO completely disappeared, the heating reaction was stopped to obtain polyamide modified phenolic resin.
Embodiment 2
[0010] Accurately weigh 100g of polyamide-modified phenolic resin, 6g of n-hexanol, 0.1g of polymerization inhibitor p-hydroxyanisole, and 0.01g of catalyst butyl titanate, add them into a three-necked flask with a thermometer, raise the temperature to 65 degrees, and start Add 22g of diisocyanate IPDI dropwise, control the temperature at 70°C, and react for 3h. The content of NCO group was analyzed by infrared spectrometer, and when the peak of NCO completely disappeared, the heating reaction was stopped to obtain polyamide modified phenolic resin.
Embodiment 3
[0012] Accurately weigh 120g of polyamide-modified phenolic resin, 7g of n-hexanol, 0.1g of polymerization inhibitor p-hydroxyanisole, and 0.01g of catalyst butyl titanate, add them into a three-necked flask with a thermometer, raise the temperature to 65 degrees, and start Add 22g of diisocyanate IPDI dropwise, control the temperature at 73 degrees, and react for 4 hours. The content of NCO group was analyzed by infrared spectrometer, and when the peak of NCO completely disappeared, the heating reaction was stopped to obtain polyamide modified phenolic resin.
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