Modified polyphenyl ether resin and application thereof

A polyphenylene ether resin and modification technology, which is applied in the field of copper clad laminates, can solve the problems of the significance of undescribed hydrocarbon groups, the influence of electrical properties, heat resistance, and the uniformity of the resin matrix, and achieve phase separation "islands in the sea" "Phenomenon improvement, improved adhesion, and heat-resistant performance

Active Publication Date: 2017-05-31
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this type of polyphenylene ether resin has poor compatibility with thermosetting resins such as epoxy resins, and there is often a phase-separated "sea island" phenomenon in the cured product, which affects the uniformity of the resin matrix, electrical properties, heat resistance, etc. cause negative impact
[0005] A composition of polyphenylene ether and epoxy resin is mentioned in CN102702680A, the molecular weight of the polyphenylene ether used in it is small, and the compatibility with epoxy resin is better, but its Df is on the high side; A cross-linkable polyphenylene ether resin, in which the side chain is also linked to benzene rings with H or 1 to 3 hydrocarbon groups; CN105419348A mentions a polyphenylene ether resin modified by terminal epoxy groups , the side chain position of its polyphenylene ether structure is H or 1 to 8 hydrocarbon groups, but the significance of the existence of the hydrocarbon group at the side chain position is not described, and it is changed in the middle part of the structure of the commonly used polyphenylene ether resin The hydrocarbon group of the side chain is a more complicated process
[0006] In the current technology, the molecular weight of polyphenylene ether is generally reduced, or reactive groups are introduced into the end groups of polyphenylene ether to improve the compatibility between polyphenylene ether and thermosetting resin, but it has negative effects on the dielectric properties of the board. impact, and the improvement effect is not ideal

Method used

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  • Modified polyphenyl ether resin and application thereof
  • Modified polyphenyl ether resin and application thereof
  • Modified polyphenyl ether resin and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1～7 and comparative preparation example 1

[0053] Add 100 parts of polyphenylene ether powder, 200 parts of toluene and a specific number of phenolic compounds (see Table 1 for the type and number of parts) into a reactor equipped with a stirring, heating and reflux device, stir and heat to 95 ° C, keep warm Stir to dissolve completely. Divide a specific number of peroxides into ten parts, put them into the reaction kettle one by one, keep warm for 8 hours, and obtain the toluene solution of the polyphenylene ether resin modified with low molecular weight. Concentrate the above toluene solution in a rotary evaporator, then add it dropwise in methanol, filter to obtain a precipitate, and dry the precipitate in a blast oven at 100°C to obtain a low-molecular-weight modified polyphenylene ether resin. Using toluene as the mobile phase, the number average molecular weight (Mn) of the resin was measured, and the results are shown in Table 1.

[0054] Table 1

[0055]

[0056]

Embodiment 1～9 and comparative example 1～3

[0058] The modified polyphenylene ether, epoxy resin and cyanate resin obtained in the preparation example are fully dissolved in toluene (Dicy is fully dissolved in DMF), and then mixed with accelerators such as 2 ethyl-4 methylimidazole and zinc isooctanoate (See Table 2 for the type and number of parts) Mix evenly to obtain a toluene solution of the polyphenylene ether resin composition.

[0059] Impregnate the NE glass fiber cloth (Nittobo Co., Ltd., NEA2116) with the resin composition, and dry it at 155°C for 2-10 minutes to remove the solvent, so that the volatile content is less than 1%, and the gel time of the resin is 150s-200s , to obtain a prepreg with a resin content of about 55%.

[0060] Cover one HOz inverted copper foil on each side of the four overlapping prepregs, and hot press at a temperature of 200 °C and a pressure of 3.0 MPa for 90 minutes to obtain a double-sided copper-clad laminate.

[0061] Table 2

[0062]

[0063]

[0064]

Embodiment 10～14 and comparative example 4～6

[0066] Fully dissolve the modified polyphenylene ether, epoxy resin, and cyanate resin obtained in the preparation example in toluene, then mix them evenly with accelerators such as 2 ethyl-4 methylimidazole and zinc isooctanoate, and then add fillers and barriers. Combustion agent (see Table 3 for the type and number of parts), and uniformly dispersed by means such as stirring and high-speed shearing, to obtain a toluene solution of the polyphenylene ether resin composition.

[0067] Impregnate NE glass fiber cloth (Nittobo Co., Ltd., NEA2116) with the resin composition, and dry it at 155°C for 2-10 minutes to remove the solvent, so that the volatile content is less than 1%, and the gel time of the resin is 150s-200s , to obtain a prepreg with a resin content of about 55%.

[0068] Cover one HOz inverted copper foil on each side of the four overlapping prepregs, and hot press at a temperature of 200 °C and a pressure of 3.0 MPa for 90 minutes to obtain a double-sided copper-c...

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Abstract

The invention relates to modified polyphenyl ether resin and application thereof. The modified polyphenyl ether resin has a long carbon chain structure which contains at least one group of hydrocarbon group with carbon element greater than or equal to 3. The modified polyphenyl ether resin adopts the structure comprising at least one group of hydrocarbon group with carbon element greater than or equal to 3, so the compatibility between the polyphenyl ether and other resin can be enhanced, the split-phase 'island' phenomenon of a resin system is remarkably improved, the dielectric constant and the loss of a laminated plate can be reduced, the viscosity of the resin system on a metal foil can be improved, and the heat resistance of the plate is maintained.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a modified polyphenylene ether resin and its application. Background technique [0002] Polyphenylene ether resin has good heat resistance, dielectric properties and toughness, and has a good application prospect in composite materials such as laminates. However, due to the polarity difference between polyphenylene ether and traditional thermosetting resins, poor compatibility and easy phase separation, there are various difficulties in the application of polyphenylene ether. In order to enhance the compatibility between polyphenylene ether and thermosetting resins, many patents have proposed solutions, but they are insufficient in terms of feasibility and cost. [0003] It is mentioned in CN1458963A that PPO and trialkylcyanurate cured product form an IPN structure, and the side chains in the PPO structure are linked to H or 1 to 3 hydrocarbon groups that may be d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G65/48C08L71/12C08L63/00C08K13/04C08K7/00C08K7/14C08J5/24B32B15/20B32B15/08B32B27/18B32B27/06B32B7/12B32B37/12B32B37/06B32B37/10H05K1/03
CPCH05K1/0373C08G65/485C08L63/00C08L71/12B32B7/12B32B15/08B32B15/20B32B27/06B32B27/18B32B37/06B32B37/10B32B37/12C08J2463/00C08J2471/12C08J2371/12C08J2363/00B32B2457/08B32B2307/306C08J5/249C08J5/244C08K13/04C08K7/00C08K7/14
Inventor 孟运东徐莹方克洪
Owner GUANGDONG SHENGYI SCI TECH
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