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A kind of adhesive film for FPC and its preparation method and FPC

A technology of adhesive film and film layer, which is applied in the direction of adhesive, film/sheet release liner, film/sheet adhesive, etc. It can solve the problems of small amount of glue overflow, poor dimensional stability, and non-curing.

Active Publication Date: 2018-11-30
SHENZHEN MEIXIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the technical problems of poor high temperature resistance and poor dimensional stability of existing acrylic adhesives, which limit their application in FPC, the present invention provides a non-curing at low temperature, curing after heating, short curing time at high temperature, and overflowing. Small amount of glue, high peel strength to metals and plastics, high temperature resistance, no blistering and no delamination after lead-free reflow soldering, etc. FPC adhesive film and its preparation method and FPC

Method used

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  • A kind of adhesive film for FPC and its preparation method and FPC
  • A kind of adhesive film for FPC and its preparation method and FPC
  • A kind of adhesive film for FPC and its preparation method and FPC

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preparation example Construction

[0032] The present invention also provides a preparation method for the above-mentioned FPC film, the steps comprising: mixing 50-80 parts by weight of an acrylic adhesive, 3-10 parts by weight of a curing agent, and 0.01-1 parts by weight of a curing accelerator , 0.01-0.2 parts by weight of the catalyst, optional 0.05-0.5 parts by weight of the toughening agent, optional 0.05-0.5 parts by weight of the silane coupling agent and solvent mixed, coated on the substrate, dried sticky For layering, the drying temperature can be 100-125°C. Generally, the solvent is evaporated to dryness to form a film, and it takes about 3 minutes. Preferably, the preparation of the acrylate adhesive includes 5-20 parts by weight of soft monomers, 8-30 parts by weight of hard monomers, 0.5-5 parts by weight of functional monomers, 0.01-1.00 parts by weight, preferably 0.01-0.1 After mixing the initiator and the solvent in parts by weight, they are reacted at 50°C-70°C, preferably 60°C-62°C. The s...

Embodiment 1

[0047] (1) First measure 0.03g of p-toluenesulfonic acid, add 2g of ethyl acetate to dissolve, stir evenly, then add 30g of the acrylate adhesive prepared above, 3.6g of benzoxazine resin, 0.08g of 2,4- Mix toluene bisdimethylurea, 0.1g nano-silica, 0.07g KH-560 and 15g toluene, and stir evenly at room temperature;

[0048] (2) Apply the above mixture on the single-side peeling PET film, dry it at 100°C, and then cover with a layer of single-side peeling PET film to obtain sample S1.

Embodiment 2

[0050] (1) First measure 0.03g of p-toluenesulfonic acid, add 2g of ethyl acetate to dissolve, stir evenly, then add 30g of the acrylate adhesive prepared above, 3.6g of benzoxazine resin, 0.1g of 2-ethyl - Mix 4-methylimidazole, 0.1g nano-silicon dioxide, 0.07g KH-560 and 15g toluene, and stir evenly at room temperature;

[0051] (2) Apply the above mixture on the single-side peeling PET film, dry it at 100°C, and then cover it with a layer of single-side peeling PET film to obtain sample S2.

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Abstract

The invention provides an adhesive film for an FPC, a preparation method of the adhesive film and the FPC. The adhesive film for the FPC comprises a bonding layer, wherein the bonding layer is prepared from the raw materials containing the following components in parts by weight: 50 to 80 parts of an acrylate adhesive, 3 to 10 parts of a curing agent, 0.01 to 1 part of a curing accelerator and 0.01 to 0.2 part of a catalyst; the acrylate adhesive contains epoxy functional groups, so that the adhesive film has the advantages that the adhesive film is not cured at low temperature but is cured after being heated, the adhesive film is short in high-temperature curing time and small in flue overflowing amount, the adhesive film has high peel strength for metal and plastic respectively, and the adhesive film is resistant to high temperature without foaming or layering after lead-free reflow soldering.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to an adhesive for FPC, and in particular to an adhesive film for FPC, a preparation method thereof, and an FPC. Background technique [0002] The adhesive market for FPC (flexible circuit board) is mostly acrylic, epoxy and polyester adhesives. There are few domestic studies on FPC adhesives, and a large number of foreign studies mainly focus on modified epoxy resin adhesives. According to reports, it often takes more than 60 minutes for the film prepared by modified epoxy resin adhesives to cure. Or pressurize and cure for 30 minutes and then bake at high temperature for 30 minutes to obtain better performance. The curing time is too long, which increases the production cost and reduces the efficiency, and also increases the energy consumption in production. Compared with acrylic adhesives, it has the advantages of low cost, less glue overflow and excellent adhesion, but the functional ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/12C09J11/08C09J7/25C09J7/40
CPCC08L2201/08C08L2203/20C09J7/255C09J11/08C09J133/12C09J2203/326C09J2301/122C08L79/04C08L61/06
Inventor 肖红勤李周
Owner SHENZHEN MEIXIN ELECTRONICS
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