A kind of low dielectric constant environment-friendly underfill glue and preparation method thereof

A technology of underfill glue and low dielectric constant, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of poor arc resistance, poor weather resistance, and poor electrical performance, and achieve high arc resistance, Excellent weather resistance and low dielectric constant effect

Active Publication Date: 2021-05-04
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, ordinary underfills have problems such as poor electrical properties, poor arc resistance, poor weather resistance, and do not meet environmental protection requirements.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1) Weigh out 310 g of hydrogenated bisphenol A epoxy resin YS-GF015 (Nanjing Yuanshu Pharmaceutical), 120 g of hollow glass microspheres 8054 (Potters, USA), 240 g of spherical silicon micropowder FE920A-SQ (Admatechs, Japan), methyl tetra Diglycidyl hydrogen phthalate XY-813 (Xinyuan, Anhui) 50g, core-shell rubber epoxy resin BPF-307 (NIPPON SHOKUBAI, Japan) 90g, silane coupling agent KH-560 (Tianjin Reagent Factory) 3g, Defoamer AFCONA-2038 (Efcona, Malaysia) 3g, black color paste (PENNCOLOR, USA) 4g, put into the reaction kettle, the speed is 800 rpm, stirred for 3h, and mixed evenly;

[0028] 2) Add the mixture obtained in step 1) into the colloid mill JM-L50 (Wenzhou Longxin Machinery), adjust the equipment gap to 0.03mm, cut the grinding cycle for 2h, and fully grind;

[0029] 3) Cool the mixture obtained in step 2) to 20-30°C and weigh 180 g of the curing agent-modified spirocyclic diamine MY-HK-1 (Ajinomoto Japan) into the reaction kettle, with a rotating speed ...

Embodiment 2

[0031] 1) Weigh out 200 g of hydrogenated bisphenol A epoxy resin EP-4080E (ADEKA, Japan), 160 g of polycyclic aromatic epoxy resin HP-4032D (DIC, Japan), and 60 g of hollow glass beads G400 (3M, USA), spherical Silicon powder SO-E2 / 24C (Admatechs, Japan) 340g, pentaerythritol tetraglycidyl ether XY-634 (Xinyuan, Anhui) 30g, core-shell rubber epoxy resin BPF-307 (NIPPON SHOKUBAI, Japan) 80g, silane coupling agent KH -560 (Tianjin Reagent Factory) 3g, defoamer AFCONA-2270 (Malaysia Efcona) 3g, black color paste (American PENNCOLOR) 4g, put into the reaction kettle, rotate speed 800 rpm, stir for 3h, and mix well;

[0032] 2) Add the mixture obtained in step 1) into the colloid mill JM-L50 (Wenzhou Longxin Machinery), adjust the equipment gap to 0.03mm, cut the grinding cycle for 2h, and fully grind;

[0033] 3) Cool the mixture obtained in step 2) to 20-30°C and weigh 180 g of the curing agent-modified spirocyclic diamine MY-HK-1 (Ajinomoto Japan) into the reaction kettle, with...

Embodiment 3

[0035] 1) Weigh out 180 g of hydrogenated bisphenol A epoxy resin YS-GF015 (Nanjing Yuanshu Pharmaceutical), 120 g of biphenyl epoxy resin NC-3000 (Nippon Chemicals), 90 g of hollow glass beads 8054 (Potters, USA), Spherical silica powder FE920A-SQ (Admatechs, Japan) 320 g, diglycidyl methyltetrahydrophthalate XY-813 (Xinyuan, Anhui) 20 g, thermoplastic resin modified epoxy resin RA840 (CVC, USA) 60 g, Silane coupling agent KH-560 (Tianjin Reagent Factory) 3g, antifoaming agent AFCONA-2038 (Malaysia Efcona) 3g, black color paste (American PENNCOLOR) 4g, put into the reaction kettle, rotate speed 800 rpm, stir 3h, mix evenly;

[0036] 2) Add the mixture obtained in step 1) into the colloid mill JM-L50 (Wenzhou Longxin Machinery), adjust the equipment gap to 0.03mm, cut the grinding cycle for 2h, and fully grind;

[0037] 3) Cool the mixture obtained in step 2) to 20-30°C and weigh 200 g of curing agent phenol aralkyl and its derivative MEH-8000H (Mingwa Chemicals, Japan) into ...

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Abstract

The invention relates to a low dielectric constant environment-friendly bottom filling adhesive and a preparation method thereof, belonging to a single-component epoxy resin adhesive, and consists of the following raw materials in parts by weight: 30-38 parts of epoxy resin, curing agent 8-20 parts, 33-46 parts of filler, 2-5 parts of thinner, 6-9 parts of toughening agent, 0.3-0.5 parts of silane coupling agent, 0.3-0.5 parts of defoamer, 0.2-0.8 parts of pigment. The underfill glue prepared by the invention has the advantages of low halogen content, low dielectric constant, high arc resistance, high weather resistance, etc., so that the packaging components have higher environmental protection, electrical insulation and reliability.

Description

technical field [0001] The invention relates to a low dielectric constant environment-friendly underfill and a preparation method thereof, belonging to the field of adhesives. Background technique [0002] With the continuous innovation of the electrical and electronic industry, more and more requirements have been placed on electronic packaging technology. Green environmental protection, multi-function, energy saving and safety have become the main development trends of electronic products. At the same time, the packaging industry proposes that high-precision packaging technologies such as BGA and CSP are widely used. Underfill is one of the key electronic materials required for microelectronic packaging such as BGA and CSP. Its main function is to protect the high-density arrangement of solder balls and chips, and to ensure the processability, weather resistance and safety of packaged components. [0003] At present, most underfills have high halogen content, which does ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08L2203/206C08L2205/025C08L2205/03C08L2205/04C08L2207/53C09J11/04C09J11/06C09J11/08C09J163/00C08L63/00C08K7/20C08K7/18C08K5/5435
Inventor 闫善涛王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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