Curable resin composition, and composite material and preparation method thereof

A technology for curing resins and composite materials, which is applied in the field of curable resin compositions, composite materials and their preparation, can solve problems such as poor friendliness, high energy consumption, poor economic and social benefits, etc., achieve rapid curing and reduce production The effect of cost and excellent latency

Pending Publication Date: 2022-01-28
BAMSTONE NEW MATERIAL TECH (WUHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional method has poor environmental friendliness, high energy consumption, and poor economic and social benefits

Method used

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  • Curable resin composition, and composite material and preparation method thereof
  • Curable resin composition, and composite material and preparation method thereof
  • Curable resin composition, and composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Take a low molecular weight epoxy equivalent of 180-190 in 100 parts of bisphenol A type epoxy resin, into a reaction vessel, 30 parts of bisphenol A was added, heated to 80 ℃, bisphenol A was dissolved with stirring. Was then added 1 part of methyl triphenylphosphonium bromide, after mixing, the temperature was raised to 120 deg.] C, bisphenol A epoxy resin with an exothermic reaction started. After completion of the exotherm, the temperature was raised to 160. deg.] C, the reaction was kept for 3 hours to obtain a first component.

[0035] Take a small molecule compound represented by the formula 2, as the second component.

[0036]

[0037] The first and second components, according to the ratio of 80:20, mixed at 80 deg.] C, cooled to 25 deg.] C standby, the composition 1.

[0038] After 30 days storage at room temperature, the above-described composition 1 is not yet crosslinked and cured.

[0039] The above-described composition 1 was placed in an oven at 120 deg.] ...

Embodiment 2

[0041] Taken 180-190 epoxy equivalent of low molecular weight bisphenol A epoxy resin 90 parts and 10 parts of novolac type epoxy resin (NPPN-638S, commercially available epoxy resin to South (Kunshan) Co., Ltd.), into the reaction vessel, was added 30 parts of bisphenol A, was heated to 80 ℃, bisphenol A was dissolved with stirring. After cooling down to less than 40 ℃ 1 part of triphenylphosphine was added, stirred uniformly, to obtain the first component.

[0042] Take formula 2, a small molecule compound represented by formula 1 3: 1 mixture of the second component.

[0043]

[0044] The first and second components, according to the ratio of 70:30, mixed at 60 deg.] C, the composition 2.

[0045] After 30 days storage at room temperature, the above compositions 2, an increase in viscosity, but no crosslinking.

[0046] The above composition is 2, taken into an oven at 120 deg.] C after 2 hours, has been found to crosslinking.

Embodiment 3

[0048] Take Example 2 Preparation of composition 2 at 60 ℃ immersed carbon fiber sheet, made of a prepreg. The above-mentioned prepreg, the thickening at 40-45 ℃ for 24 hours, the viscosity of the resin increases, the fluidity is deteriorated.

[0049] The above-described prepreg on a mold paving, with a hydraulic press nip, incubated at 150 ℃ 5 min. Releasing, to obtain a carbon fiber-reinforced composite sheet a.

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PUM

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Abstract

The invention provides a curable resin composition, and a composite material and a preparation method thereof. According to the invention, the curing reaction of the curable resin composition is not only a reaction of a curing agent and an epoxy functional group, but also a composite reaction of a plurality of reactions; and the curable resin composition also has latency and can be used for preparing composite prepreg and a single-component adhesive.

Description

technical field [0001] The invention relates to a curable resin composition, a composite material and a preparation method thereof, belonging to the field of polymer composite materials. Background technique [0002] For the curing of epoxy resin, various types of curing agents can generally be added, and the epoxy resin can be cross-linked and cured through the reaction of the curing agent with the epoxy functional group. [0003] Composite material prepregs, one-component adhesives and other application fields, it is hoped that after the epoxy resin and the curing agent are mixed, the reaction is slow at low temperature and has a long storage period; after heating to high temperature, it can react quickly, that is, The so-called latency. The latent curing agents of epoxy resin mainly include dicyandiamide and its modified products, modified imidazole, modified tertiary amine, etc., which mainly react with the epoxy functional group of epoxy resin to cure the resin. Howev...

Claims

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Application Information

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IPC IPC(8): C08G59/40C08G59/14C08G59/20C08L63/00C08L63/04C08J5/24C08K7/06
CPCC08G59/4057C08G59/1438C08G59/20C08L63/00C08J5/24C08J2363/00C08J2463/04C08K7/06C08L2205/025C08L63/04
Inventor 刘伟
Owner BAMSTONE NEW MATERIAL TECH (WUHAN) CO LTD
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