Attaching method for flexible substrate of OLED (Organic Light Emitting Diode) device and flexible OLED device

Abstract

The invention provides an attaching method for a flexible substrate of an OLED (Organic Light Emitting Diode) device and a flexible OLED device. The attaching method comprises the following steps: coating one round of sealant on the edge of the upper surface of a rigid carrier to form a glue frame; then, under a vacuum state, coating the lower surface of the rigid carrier with the flexible substrate of which the area is greater than that of the rigid carrier; tightly fitting with the lower surface of the rigid carrier; turning the part, which is greater than the rigid carrier, of the flexible substrate to the upper surface of the rigid carrier to enable the edge part of the flexible substrate to be pasted to the upper surface of the rigid carrier through the glue frame; solidifying the sealant; forming the flexible OLED device on the surface of the flexible substrate; and peeling the flexible OLED device from the rigid carrier. The attaching method for the flexible substrate of the OLED device provided by the invention has an artful design method, the flexible substrate can be tightly attached to the rigid carrier, and technologies including defoaming and the like are omitted.

Description

technical field [0001] The invention relates to a method for attaching a flexible substrate of an OLED device and a flexible OLED device. Background technique [0002] Organic Light-Emitting Diode (OLED) devices, as a new generation of displays, have attracted widespread attention due to their characteristics such as self-illumination, high brightness, wide viewing angle, low energy consumption, and bendability, and have been used in mobile phones. and on TV. The substrate of the OLED device does not require a backlight, and the organic material can be made to emit light by passing electricity to the organic material made on the glass. Because it is a very thin organic material for self-illumination, it makes flexible display possible. At present, plastic substrates such as polyethylene naphthalate (PEN) or polyethylene terephthalate (PET) are usually used in the production process of flexible display panels of OLED devices, but plastic substrates are easy to bend and defo...

AI Technical Summary

Problems solved by technology

At present, plastic substrates such as polyethylene naphthalate (PEN) or polyethylene terephthalate (PET) are usually used in the production process of flexible display panels of OLED devices, but plastic substrates are easy to bend and deform. , the process technology cannot be carried out alone

Therefore, it is necessary to flatly attach the plastic substrate to the non-deformable glass substrate to complete all the processes before peeling; the following process difficulties appear in the attaching process: 2. During the high-temperature process, the adhesive will have different degrees of outgassing and curing. The former will make the substrate uneven, and the latter will make the peeling of the final device change. very difficult

[0003] Since then, the method of attaching the plastic frame has also been proposed, such as figure 1 As shown, first coat the high-temperature-resistant curing glue in the form of a glue frame 2 on the carrier glass 1, attach the flexible substrate to the carrier glass 1, and when the process is completed, cut along the glass cutting line of the inner frame of the substrate 4 Carry out flexible device cutting to complete the peeling work of the device; even so, there is a certain height due to the curing glue, such as figure 2 As shown, the flexible substrate 3 still cannot be tightly attached to the carrier glass 1 after the surface of the carrier glass 1 is attached, and the flatness and residual gas will still affect the surface flatness of the flexible substrate during the process.

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