Ceramic substrate copper plating system for LED (Light Emitting Diode) lamp

Abstract

The invention discloses a ceramic substrate copper plating system for an LED (Light Emitting Diode) lamp. The ceramic substrate copper plating system comprises a copper plating assembly and a transmitting assembly, wherein the copper plating assembly is positioned just above the transmitting assembly; both the copper plating assembly and the transmitting assembly are positioned in an airtight environment; the transmitting assembly comprises a mounting base plate; a first ceramic substrate transporting part and a second ceramic substrate transporting part are arranged at the upper part of the mounting base plate, have identical structure and size and are symmetrically arranged at the upper part of the mounting base plate; the first substrate transporting part also comprises supporting legs, supporting sleeves, Z-shaped connecting plates, driving parts, a conveying belt, conveying gears and fastening bolts; the conveying belt is arranged on the conveying gears in a sleeving manner; vacuum chucks are uniformly arranged at the upper part of the conveying belt. According to the ceramic substrate copper plating system for the LED lamp, automation and standardization of ceramic substrate copper plating are realized, the structure is simple, artificial participation degree is reduced, the harm to workers caused by a copper plating environment is avoided, and the health and the safety of operating workers are guaranteed.

Description

[0001] Technical field: [0002] The invention relates to the technical field of ceramic substrate production equipment, in particular to a copper plating system for ceramic substrates for LED lamps. [0003] Background technique: [0004] With the rapid development of science and technology and the pursuit of higher quality of life by human beings, the application characteristics of many products tend to be extremely strict, which makes the use of newly developed materials a necessary means. Today's integrated circuit packaging technology is subject to the pursuit of The effect of better transmission efficiency and miniaturization (such as electronic components of mobile phones and mini-notebook computers), so the industry has invested considerable research funds in this area, and after years of research, a ceramic Ceramic substrates made of high-quality materials, and ceramic substrates have excellent insulation, chemical stability, electromagnetic properties, high hardness, ...

AI Technical Summary

Problems solved by technology

[0005] At present, ceramic substrates are one of the main types of substrates used in LED lamps. Before the production of LED lamps, ceramic substrates need to be copper-plated. During the copper-plating process, manual participation is high, and workers are always exposed to leakage. Not only is it easy to cause harm to the human body, but the disposal after use is likely to cause environmental pollution

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