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Efficient chip LED packaging structure

A technology of LED packaging and LED brackets, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of excessive operating current and short life of SMD packaging, and achieve improved brightness, long life, and slow aging speed. Effect

Inactive Publication Date: 2017-06-09
ZHENGZHOU SENYUAN NEW ENERGY TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a high-efficiency SMD LED package structure, overcome the problems of excessive working current and short life of the existing SMD package, and provide a SMD LED with slow brightness attenuation, stable performance, and high brightness Package structure

Method used

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  • Efficient chip LED packaging structure

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Embodiment Construction

[0008] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0009] figure 1 It is a top view of a high-efficiency patch LED packaging structure provided by the present invention, including an LED bracket 1, an LED chip 2 arranged in the bracket 1, the LED bracket 1 to which it belongs is designed with an inverted trapezoidal groove 3, and chips 2 (4 pieces chips) are respectively placed in four independent bowls, and the bowls are designed to be concave on both sides and slightly convex in the middle, the walls of the four grooves are all designed as inverted trapezoids, and the front surfaces of the bottom bowls of the four grooves are all The silver-plated layer is used to place 4 chips. The slightly protruding part in the middle of the four bowls is the PPA layer. The walls of the bowls have a certain gradient to increase the angle of light; and the back of each groove at the bottom of the bracket is Desig...

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Abstract

The present invention provides a high-efficiency SMD LED packaging structure, which includes an LED bracket and an LED chip. The LED bracket is a bowl structure with four inverted trapezoidal grooves, and the chips are respectively distributed in four independent bowls. The bowl of the LED bracket has an inverted trapezoidal structure. The front surface of the bottom of the four grooved bowls is provided with a silver-plated layer. The thickness of the silver-plated layer is 80μm-120μm. Layer, there are two groups of LED chips in the crystal-bonding area, each group of chips includes two small LED chips in series, with this package structure, the working current of each LED chip is 30mA, so that the light attenuation speed of the LED is slower, and the LED The lifespan is longer, and four chips are used to work at the same time. The LED lamp beads emit more uniform light, and the light efficiency can be increased by 7%.

Description

technical field [0001] The invention belongs to the lighting field of semiconductor technology and relates to a high-efficiency patch LED packaging structure. Background technique [0002] The global energy shortage is becoming increasingly serious. In the field of lighting technology, LED light sources have become a new generation due to their advantages such as low-voltage power supply, low energy consumption, strong applicability, high stability, short response time, no pollution to the environment, and multi-color luminescence. The mainstream of lighting sources. At present, many LED products have increasingly replaced traditional incandescent lamps and fluorescent lamps, such as LED bulb lamps, LED tubes, etc. SMD LEDs are also attracting more and more attention, such as 2835, 3528, 5050, 5730, 3014, etc. are widely used in fluorescent tubes, bulb lamps, panel lights and other lamps. [0003] Most of the SMD LED lamp beads used today use LED chips with a voltage of 3.0...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/60H01L25/13
CPCH01L33/486H01L25/13H01L33/60
Inventor 李帅谋王文杰
Owner ZHENGZHOU SENYUAN NEW ENERGY TECH
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