Exhaust box for developing equipment and yellow light process developing equipment

Abstract

The invention provides a fumer for development equipment. The fumer comprises a tank, one side surface of which is uniformly provided with air vents. The tank is equipped with a connecting pipe which is communicated with the inner chamber of the tank. The invention also provides yellow light process development equipment which comprises multiple mutually spiced development chambers. A transport mechanism is arranged inside the development chamber. The same position of each development chamber is respectively provided with an exhaust pipe which is communicated with the development chamber. The exhaust pipe is provided with a volume damper. The yellow light process development equipment also comprises the fumer for the development equipment. A fumer which is connected to the exhaust pipe is respectively arranged inside each development chamber. The air vents are opposite to the top of the development chamber. The connecting pipe is connected to the exhaust pipe. In comparison with the prior art, flow direction turbulence of development steam due to single air vent for exhausting is avoided, and photoresistive hole breakout and photoresistive line breakdown due to irrational design of development exhausting after yellow light manufacture are improved.

Description

technical field [0001] The invention relates to a liquid crystal panel manufacturing technology, in particular to an exhaust box for developing equipment and yellow light process developing equipment used for array process glue coating and developing process after exposure. Background technique [0002] In the thin film transistor liquid crystal display manufacturing process, the yellow light process of the array process is glued, and the development process after exposure is mostly used in the dipping treatment method (Puddle method). The main function is: when it is a positive photoresist, it is different from the exposed photoresist Perform a reaction to dissolve it in the developer. When it is a negative photoresist, it reacts with the unexposed photoresist to dissolve it in the developer. After the development process, the substrate photoresist can define the exposure film (Mask) The graphics of the bottom layer are protected, and then the subsequent etching and photore...

AI Technical Summary

Problems solved by technology

At present, when the substrate after the coating and exposure process is developed by the Puddle method, the air flow in the development chamber may be disturbed due to the unstable exhaust flow of the factory, which may cause the development steam to advance before the developer is not coated. Bombarded on the photoresist of the substrate, because the photoresist is extremely sensitive to the developer in the array, it will cause part of the photoresist on the substrate to be developed in advance, resulting in the exposure of the area that should be protected by the photoresist, and the problem of photoblocking lines, and then During the subsequent etching process, the circuit pattern is broken

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