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A kind of manufacturing method of curved surface circuit

A manufacturing method and circuit technology, applied in the directions of printed circuit parts, conductive pattern formation, etc., can solve the problems of unfavorable mass production, low production efficiency, complicated preparation steps, etc., and achieve easy mass production, low processing cost, and high production efficiency. Efficient effect

Active Publication Date: 2019-08-20
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This technical solution adopts thin film deposition technology, traditional photolithography, 3D printing technology and other methods to produce curved surface structural parts. The preparation steps are complicated, the process is cumbersome, and the production efficiency is low, which is not conducive to industrial large-scale production, and the substrate is limited to metal or insulating dielectric film

Method used

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  • A kind of manufacturing method of curved surface circuit
  • A kind of manufacturing method of curved surface circuit
  • A kind of manufacturing method of curved surface circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] In Example 1 and Example 2, the modification liquid solvent and the softening and bonding agent used were all purchased from Taobao. item.htm? spm=a1z10.1-c.w137644-2604553046.47.guSUlZ&id=2219208735 sells grooming fluid and softening adhesive products.

[0070] Now take the PVA film as a specific example to further illustrate the present invention:

[0071] Example 1

[0072] 1) First print the conductive wiring structure of the circuit on the film 3 (the film 3 used in this embodiment is a PVA film with a thickness of 200 μm, and a common backing paper 5 is pasted under the film), such as figure 1 shown;

[0073] Specifically include:

[0074] a) Use CAD software (Solidworks) to design the conductive wiring structure of the circuit;

[0075] b) According to the conductive wiring structure of the circuit, first use the software Repetier-Host to write the Gcode program to control the pneumatic circuit printer, and use the printing speed of 750mm / s when writing the ...

Embodiment 2

[0081] 1) First print the conductive wiring structure of the circuit on the film 3 (the film 3 used in this embodiment is a PVA film with a thickness of 200 μm, and a common backing paper 5 is pasted under the film), such as figure 1 shown;

[0082] Specifically include:

[0083] a) Use CAD software (Solidworks) to design the conductive wiring structure of the circuit;

[0084] b) According to the conductive wiring structure of the circuit, first use the software Repetier-Host to write the Gcode program to control the pneumatic circuit printer, and use the printing speed of 750mm / s when writing the Gcode program. (This pneumatic circuit printer includes an air pump, an air pump controller, a modified 3D FDM printer, and a computer. The air pump controller is mainly used to control the air pump to provide a set stable air pressure. The computer controls the modified 3D FDM printer through the written control code. Carry out circuit circuit printing.) Then set the printing ini...

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Abstract

The invention discloses a manufacturing method of curve surface circuit manufacturing. The method comprises the following steps of (1) printing a circuit conductive wire distribution structure on a high molecular plastic film by using conducting ink; (2) putting the film onto the surface of a first solvent to perform soaking extension; uniformly spraying a player of softening agents capable of softening the film onto the film; (3) sticking the softened film onto the surface of a printed object; uniformly spraying a layer of dissolving reagent capable of dissolving the film into a sticking layer; (4) after the drying, preparing a curve surface circuit. The manufacturing method of the curve surface circuit manufacturing has the advantages that the manufacturing process is simple; the processing cost is low; the three-dimensional structure is precise and controllable; the manufacturing efficiency is high; a one-layer or multi-layer circuit is manufactured on the surface of flexible or non-flexible solid irregular surface in any shape, so that the method can be applied to the circuit manufacturing fields of flexible electronic circuits and the like.

Description

technical field [0001] The invention relates to the field of making flexible or non-flexible circuits, in particular to a method for making curved-surface circuits. Background technique [0002] Circuit manufacturing is the process of integrating electronic components such as chips, diodes, transistors, resistors, capacitors, etc. that have certain functional circuits, and the interconnecting wires connected to them on the surface of a physical object. At present, the most commonly used is the printed circuit board (PCB), which is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. The steps of PCB circuit manufacturing are mainly to use thermal transfer method or photosensitive wet film method to make the designed interconnection wires on the circuit board, which has the characteristics of designability, high reliability and manufacturability. At present, circuit manufacturing methods...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/12
Inventor 贺永杨洋傅建中
Owner ZHEJIANG UNIV