Adjustable polishing head mechanism for magnetic compound fluid

Abstract

The invention relates to an adjustable polishing head mechanism for magnetic compound fluid. The adjustable polishing head mechanism comprises a magnet rotating mechanism and a liquid carrying plate rotating mechanism. A permanent magnet in the magnet rotating mechanism is eccentrically fixed to the lower portion of a magnet disc. The magnet disc is connected with a first motor through a main shaft. The first motor drives the main shaft to drive the permanent magnet to rotate, and a high-speed rotating magnetic field is produced. A connecting bracket in the liquid carrying plate rotating mechanism is a round sleeve and is installed on the outer side of the magnet rotating mechanism. A liquid carrying plate serves as an end cover of the connecting bracket and is installed below the permanent magnet. A V-shaped belt is connected to a V-shaped belt wheel and the connecting bracket in a sleeving mode. A second motor is connected with the V-shaped belt wheel through a coupler and drives the connecting bracket and the liquid carrying plate on the connecting bracket to rotate through the V-shaped belt wheel, so that the magnetic compound fluid on the liquid carrying plate rotates, and thus polishing removing of a workpiece is achieved. The adjustable polishing head mechanism for the magnetic compound fluid has the characteristics of being simple in structure, high in material removing efficiency, wide in applicable magnetic cluster size range and the like.

Description

technical field [0001] The invention relates to a polishing head mechanism, in particular to an adjustable magnetic compound polishing polishing head mechanism. Background technique [0002] Magnetic compound fluid (MCF) polishing is a new type of nano-scale ultra-precision machining technology. It uses magnetic compound fluid under the action of a magnetic field as a semi-solid medium to polish the workpiece. It has the advantages of controllable polishing process, high precision of workpiece surface shape, no subsurface damage, controllable and variable polishing head size, and deterministic processing of materials. Magnetic composite fluid polishing has broad development prospects and engineering Value. [0003] In the existing magnetic composite fluid polishing head devices, the liquid carrier plates that carry the magnetic composite fluid are mostly smooth planes, and the friction between the magnetic composite fluid and the magnetic composite fluid is relatively small...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to aim at the shortcomings of the low removal efficiency of traditional magnetic composite fluid polishing materials, carry out structural design on the liquid carrier plate in the magnetic composite fluid polishing head, and propose a kind of liquid carrier plate surface with regular tetrahedral grooves and the size Adjustable Magnetic Composite Fluid Polishing Head Mechanism

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