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Packaging structure of OLED device and preparation method for packaging structure, and metal mask plate

A packaging structure and device technology, applied in the field of OLED devices, can solve the problems of OLED device falling off and the influence of bending performance of OLED devices, and achieve the effect of improving bending performance and reducing bending stress

Inactive Publication Date: 2017-06-20
SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

However, when the OLED device is bent to a large extent, the inorganic layer will bear a large bending stress, and it is very easy to fall off from the OLED device, which will affect the bending performance of the OLED device.

Method used

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  • Packaging structure of OLED device and preparation method for packaging structure, and metal mask plate
  • Packaging structure of OLED device and preparation method for packaging structure, and metal mask plate
  • Packaging structure of OLED device and preparation method for packaging structure, and metal mask plate

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Embodiment Construction

[0033] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the encapsulation structure of an OLED device and its preparation method and metal mask provided by the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. . In the drawings, the same reference numerals are used throughout the specification and the drawings to denote the same structures and regions.

[0034] See figure 1 , figure 1 It is a schematic structural diagram of the packaging structure of an OLED device in the prior art. Such as figure 1 As shown, the OLED device 12 is prepared on a transparent flexible substrate 11, and the encapsulation structure 100 of the OLED device 12 is alternately formed on the OLED device 12 with barrier layers 13, 15, 17 and buffer layers 14, 16 covering each other. Among them, the barrier layers 13, 15, 17 are used to effectively block water and oxygen...

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Abstract

The invention discloses a packaging structure of an OLED device and a preparation method for the packaging structure, and a metal mask plate. The packaging structure of the OLED device comprises a plurality of alternate barrier layers and buffer layers above the OLED device; at least one barrier layer adopts a patterned structure; and a patterned region of the barrier layer is filled with the corresponding buffer layer. By setting the barrier layer into the pattered structure and by filling the patterned region of the barrier layer with the corresponding buffer layer, when the OLED device is bent, the bending stress on the barrier layer can be released by the buffer layer is which is arranged in the patterned region of the barrier layer in a filling way, so that bending stress on the barrier layer can be lowered, the OLED device can be bent for a higher amplitude, and the bending performance of the OLED device is further improved.

Description

Technical field [0001] The invention relates to the technical field of OLED devices, in particular to a packaging structure of an OLED device, a preparation method thereof, and a metal mask. Background technique [0002] With the development of display technology, flexible display technology has gradually become a research hotspot in the field of flat panel displays, and OLED displays have gradually become the general direction of display development. Flexible OLED devices in OLED displays have become a research hotspot. Among them, flexible OLED devices have very high requirements for packaging structures, and their water vapor transmission rate is less than 10 -6 g / m 2 / day, oxygen penetration rate is less than 10 -5 cc / m 2 / day; Therefore, the packaging structure plays an important role in the production of OLED devices and is one of the key factors affecting product yield. [0003] In the prior art, an encapsulation structure is often formed by alternately arranging inorganic a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/52H01L51/50
CPCH10K71/00H10K50/844
Inventor 李文杰
Owner SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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