Aluminum-foil substrate applicable to flexible circuit board and manufacturing method of aluminum-foil substrate

A technology for flexible circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, chemical instruments and methods, and improvement of metal adhesion of insulating substrates. It can solve the problems of high cost and insufficient flexibility of copper foil substrates, and achieve good bending resistance. , Improve production efficiency and save production cost

Inactive Publication Date: 2017-06-27
SONGYANG ELECTRONICS MATERIAL KUSN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the above defects, the present invention provides an aluminum foil substrate suitable for flexib...

Method used

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  • Aluminum-foil substrate applicable to flexible circuit board and manufacturing method of aluminum-foil substrate
  • Aluminum-foil substrate applicable to flexible circuit board and manufacturing method of aluminum-foil substrate
  • Aluminum-foil substrate applicable to flexible circuit board and manufacturing method of aluminum-foil substrate

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Embodiment 1: First, the raw materials of the insulating adhesive layer 102 are dissolved in an organic solvent to form a liquid dispersion of the insulating adhesive layer; then, the liquid dispersion of the insulating adhesive layer is coated on the bottom surface of the aluminum foil 101 using a coating device, After being baked in an online drying oven, the contained organic solvent is removed, and the insulating colloid reaches a semi-fluid and semi-cured state; finally, a release layer 103 is pasted on the insulating adhesive layer to form an aluminum foil single-sided panel.

Embodiment 2

[0030] Embodiment 2: First, the raw materials of the insulating adhesive layer 102 are dissolved in an organic solvent to form a liquid dispersion of the insulating adhesive layer; then, the liquid dispersion of the insulating adhesive layer is coated on the bottom surface of the aluminum foil 101 using a coating device, After baking in an online drying oven, the contained organic solvent is removed, and the insulating colloid reaches a semi-fluid and semi-cured state; then the release layer 103 is pasted on the insulating adhesive layer to form an aluminum foil single-sided panel; finally, on the carrier film 105 The adhesive layer 104 is coated, and then the carrier film and the aluminum foil single panel are tightly pressed together through the adhesive layer by a laminating machine to form an aluminum foil substrate with a carrier film.

Embodiment 3

[0031] Example 3: 35 μm thick aluminum foil glue-coated substrate: an insulating glue layer with a thickness of 10 μm is coated on an aluminum foil with a thickness of 25 μm.

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Abstract

The invention relates to an aluminum-foil substrate applicable to a flexible circuit board and a manufacturing method of the aluminum-foil substrate. The aluminum-foil substrate comprises aluminum foil, an insulating adhesive layer and a release layer, wherein the aluminum foil has a top surface and a bottom surface which are opposite to each other, the release layer is adhered to the bottom surface of the aluminum foil through the insulating adhesive layer, the aluminum foil is 12-50 micrometers in thickness, the insulating adhesive layer is 5-50 micrometers in thickness and the release layer is 30-200 micrometers in thickness. The aluminum-foil substrate has the advantages that the aluminum-foil substrate is simple in structure, quite light and thin and excellent in flexibility and bending resistance, production efficiency of clients and yield are increased by using the aluminum-foil substrate, and production cost is reduced.

Description

technical field [0001] The invention relates to an aluminum foil substrate, in particular to an aluminum foil substrate applied to a flexible circuit board and a manufacturing method thereof. Background technique [0002] At present, with the development of the electronic technology industry, the electronic system is developing towards the direction of transparency, high heat resistance, multi-functionality, high density and low cost, and at the same time, it is beginning to develop towards the direction of light, thin and flexible. Curved lightweight smartphones, tablet PCs and TVs will no longer be a concept, but real objects that can be seen everywhere, so the choice of flexible aluminum foil substrates has become a very important factor. In the current market, the base material is basically copper foil base material. On the one hand, copper is a relatively precious metal. The cost of circuit boards is high due to the use of pure copper to produce circuit boards. On the o...

Claims

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Application Information

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IPC IPC(8): B32B15/20B32B15/12B32B15/09B32B15/085B32B7/06B32B7/12H05K1/02H05K3/38
CPCB32B15/20B32B7/06B32B7/12B32B15/085B32B15/09B32B15/12B32B2307/306B32B2307/714B32B2457/08H05K1/028H05K3/386H05K2201/0355
Inventor 殷波徐玮鸿周文贤
Owner SONGYANG ELECTRONICS MATERIAL KUSN
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