Simultaneous reconstruction method for temperature field and heat flow of structure body with three-dimensional or curved surface shape
A technology of structures and temperature fields, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as complex structures, curved shapes, etc., and achieve the effect of improving the accuracy of solutions
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[0029] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments. However, it should be understood that the accompanying drawings are provided only for better understanding of the present invention, and they should not be construed as limiting the present invention.
[0030] The method for simultaneously reconstructing the temperature field and heat flow of a structure containing a three-dimensional or curved surface shape provided by the present invention comprises the following steps:
[0031] 1) if figure 1 As shown, the three-dimensional surface temperature field distribution W 1 , as a boundary condition for solving the heat conduction differential equation:
[0032] Heated surface temperature W 1 :
[0033] In the formula, λ is the thermal conductivity of the structure; T is the temperature field of the structure; t is the calculation time; q 1 Indicates the heat flux of the structure; n is the direction ...
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