Simultaneous reconstruction method for temperature field and heat flow of structure body with three-dimensional or curved surface shape

A technology of structures and temperature fields, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as complex structures, curved shapes, etc., and achieve the effect of improving the accuracy of solutions

Active Publication Date: 2017-06-27
TSINGHUA UNIV
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Problems solved by technology

However, due to the complex structure of the hypervehicle engine, its shape has a curved shape, and contains internal co...

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  • Simultaneous reconstruction method for temperature field and heat flow of structure body with three-dimensional or curved surface shape

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[0029] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments. However, it should be understood that the accompanying drawings are provided only for better understanding of the present invention, and they should not be construed as limiting the present invention.

[0030] The method for simultaneously reconstructing the temperature field and heat flow of a structure containing a three-dimensional or curved surface shape provided by the present invention comprises the following steps:

[0031] 1) if figure 1 As shown, the three-dimensional surface temperature field distribution W 1 , as a boundary condition for solving the heat conduction differential equation:

[0032] Heated surface temperature W 1 :

[0033] In the formula, λ is the thermal conductivity of the structure; T is the temperature field of the structure; t is the calculation time; q 1 Indicates the heat flux of the structure; n is the direction ...

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Abstract

The invention relates to a simultaneous reconstruction method for a temperature field and heat flow of a structure body with a three-dimensional or curved surface shape. The method comprises the following steps that 1, distribution of a three-dimensional surface temperature field of the structure body is acquired to serve as a boundary solving condition of a heat-conduction differential equation; 2, the local interior temperature of the structure body is acquired to serve as a limitation solving condition of the heat-conduction differential equation; 3, a heat balance equation of the cooling channel wall surface is built according to a heat flow value of heat transmission between fluid and the cooling channel wall surface to serve as a boundary solving condition of the heat-conduction differential equation; 4, a complete control equation set is obtained by utilizing the heated surface temperature of the structure body, the heat balance equation on the interior boundary and the local interior temperature and combining the heat-conduction differential equation; 5, the control equation set is solved, and the temperature field and the heat flow density of the structure body are determined simultaneously.

Description

technical field [0001] The invention relates to a method for reconstructing temperature field and heat flow, in particular to a method for simultaneously reconstructing temperature field and heat flow of a structure containing a three-dimensional or curved surface shape by using non-contact temperature measurement. Background technique [0002] With the development of aerospace technology, the speed of aircraft continues to increase. With the increase of flight speed, severe aerodynamic heating makes the aircraft bear extremely high heat flux density. The development of an efficient thermal protection system is an urgent problem to be solved in the development of hypersonic aircraft. Accurately obtaining the heat flux density and the three-dimensional temperature field of the structure is a design problem. Prerequisites and basis for thermal protection systems. [0003] When the heat flux on the heated surface is high, the heat flow meter directly measures the heat flux den...

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/15G06F2119/08
Inventor 姜培学符泰然祝银海
Owner TSINGHUA UNIV
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