A plate processing device for laser drilling
A laser drilling and processing device technology, applied in metal processing, laser welding equipment, metal processing equipment and other directions, can solve problems such as low production efficiency and inability to meet modern production
Active Publication Date: 2019-06-21
XUNDE MACHINERY DONGGUAN CO LTD
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Problems solved by technology
[0003] When laser drilling is performed in the prior art, the equipment is mainly operated by the staff, that is, the staff first manually puts the board into the laser drilling equipment, but after the drilling of the board is completed, the staff manually puts the board into the laser drilling equipment. After the drilling is completed, the plate is taken out of the laser drilling equipment in China; the production efficiency is extremely low and cannot meet the needs of modern production
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[0034] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the implementation modes are not intended to limit the present invention.
[0035] see Figure 1 to Figure 4 , a plate processing device for laser drilling of the present invention, including a laser drilling machine 1 for drilling plates, a feeding and receiving mechanism 2 for feeding and receiving plates, and a reciprocating motion on the laser The material transfer mechanism 3 between the drilling machine 1 and the feeding and receiving mechanism 2. The material transferring mechanism 3 includes a manipulator 4 and a suction assembly 5 installed on the end of the manipulator 4. The suction assembly 5 is used to absorb the supply from the feeding and receiving mechanism 2. The plate or the plate after the laser drilling machine 1 is drilled.
[0036] Th...
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The invention relates to the ethical field of circuit board drilling equipment and in particular to a plate processing device for laser drilling. The device comprises a laser drilling machine, a material supplying and receiving mechanism and a reciprocating material transferring mechanism; the material transferring mechanism comprises a manipulator and a suction assembly; the suction assembly comprises a supporting rod and a suction box which is assembled on the supporting rod; the suction box comprises a supporting block, a cover plate and a soft buffer pad; the supporting block is provided with a gas accommodating slot and a gas pore communicating with the gas accommodating slot; a plurality of first through holes are formed in the cover plate, and a second through hole is formed in the soft buffer pad; in actual use, the manipulator drives the suction assembly to suck a plate on the material supplying and receiving mechanism and then transfers the plate into the laser driving machine to be drilled; after the drilling operation of the to-be-drilled plate is finished, the manipulator then drives the suction assembly to transfer the drilled plate from the laser drilling machine to the material supplying and receiving mechanism without manually transferring the plate in or out of the laser drilling machine by an operator, so that the drilling efficiency of the plate is enhanced.
Description
technical field [0001] The invention relates to the technical field of circuit board drilling equipment, and in particular discloses a board processing device for laser drilling. Background technique [0002] In the production process of circuit boards (such as flexible circuit boards, the English full name is Flexible Printed Circuit, referred to as FPC), it is often necessary to drill holes on the FPC. In the prior art, there are mainly two ways to drill holes on the FPC. One way One is mechanical drilling, and the other is laser drilling. Laser drilling has the advantages of high resolution and small aperture drilling. In addition, because the laser head does not touch the plate, there is no tool wear and other advantages. [0003] When laser drilling is performed in the prior art, the equipment is mainly operated by the staff, that is, the staff first manually puts the board into the laser drilling equipment, but after the drilling of the board is completed, the staff ma...
Claims
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IPC IPC(8): B23K26/382B23K26/70
CPCB23K26/382B23K26/702B23K2101/42
Inventor 陈曲剑李文舜
Owner XUNDE MACHINERY DONGGUAN CO LTD