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Probe card, wafer testing system and wafer testing method

A technology of wafer testing and probe card, which is applied in semiconductor/solid-state device testing/measurement, measuring electronics, measuring devices, etc. It can solve the problems of shrinking contact area and affecting the results of wafer acceptance testing, etc., to reduce Effect of Possibilities, Reduced Width, Increased Utilization

Active Publication Date: 2017-07-07
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the improvement of wafer integration, the contact area between the tip of the probe and the test pad is greatly reduced, thus affecting the results of the wafer acceptance test

Method used

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  • Probe card, wafer testing system and wafer testing method
  • Probe card, wafer testing system and wafer testing method
  • Probe card, wafer testing system and wafer testing method

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Embodiment Construction

[0017] The following disclosure provides many different implementations or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are of course examples only and are not intended to be limiting. For example, in the description, a first feature is formed on or on a second feature, may include embodiments in which the first feature is formed in direct contact with the second feature, and may also include that additional features may be formed on the first feature. An embodiment between a feature and a second feature such that the first feature and the second feature may not be in direct contact. In addition, the present invention may repeat element symbols and / or letters in various embodiments. Such repetition is for simplicity and clarity and is not, in itself, intended to dictate a relationship between the various embodiments and / or configurati...

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Abstract

The invention discloses a probe card, a wafer testing system and a wafer testing method. The wafer testing system comprises a wafer base and the probe card, wherein a wafer is placed on the wafer base, a plurality of test pads are formed on the wafer, and the test pads are arranged along a straight test line. The probe card comprises a plurality of probes, wherein each probe comprises a probe arm portion and a probe tip portion, an included angle between the extension of a projection line of the probe arm portion on the wafer and the straight test line ranges from about 40 to about 55 degrees, and the probe tip portion is connected to the probe arm portion so as to be in contact with the wafer.

Description

technical field [0001] The present invention relates to a probe card, a wafer test system and a wafer test method, and in particular to a probe card that allows probes to have a larger sliding process window (Slide Window) on a test pad, And a wafer test system and a wafer test method using the probe card. Background technique [0002] Wafer Acceptable Test (WAT) refers to the test structure in which the semiconductor uses the probe to feed the test signal into the wafer after completing all the manufacturing processes, and then analyzes the electrical characteristics of the wafer through the analysis of the feedback signal. In order to know whether there are defects in the wafer during fabrication. In wafer acceptance testing, probe cards are used to test multiple chips on a wafer simultaneously. The probe card includes a plurality of probes corresponding to a plurality of test pads on the wafer, and the test pads are connected to a plurality of semiconductor devices unde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCG01R1/073G01R31/2601G01R31/2831G01R31/2884G01R31/2891H01L22/34
Inventor 吴元春许长春沈倪
Owner TAIWAN SEMICON MFG CO LTD