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Manufacturing method of display substrate, display substrate and display device

A display substrate and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of reducing liquid repellency, increasing the risk of ink overflow, and pollution of the pixel boundary layer, so as to reduce overflow The effect of the risk of flow

Active Publication Date: 2019-01-01
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the traditional inkjet printing technology, during inkjet printing, there will be ink droplets that do not fall vertically and print on the pixel defining layer, contaminating the lyophobic pixel defining layer and reducing its lyophobic ability
Second, ink can climb within a pixel onto the pixel-defining layer, which can also increase the risk of ink overflow, causing ink to overflow into adjacent pixel areas

Method used

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  • Manufacturing method of display substrate, display substrate and display device
  • Manufacturing method of display substrate, display substrate and display device
  • Manufacturing method of display substrate, display substrate and display device

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Embodiment Construction

[0052] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and not to limit the present invention.

[0053] reference figure 1 , Figure 2a to Figure 2f as well as image 3 . The first aspect of the present invention relates to a manufacturing method S100 of the display substrate 100. Wherein, the method S100 includes:

[0054] S110: Provide a base substrate 110.

[0055] Specifically, such as Figure 2a As shown, the base substrate 110 may be a transparent glass substrate. When the base substrate 110 forms the first pixel defining layer 120 described below, an anode layer 170 has been formed. The material of the anode layer 170 can usually be selectively oxidized. High-performance transparent or semi-transparent conductive materials such as indium tin (ITO), silver (Ag), n...

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Abstract

The invention discloses a manufacturing method of a display substrate, a display substrate and a display device, belonging to the field of display technology. The method includes providing a base substrate; forming a first pixel defining layer, and the pixel defining layer divides the base substrate into a plurality of pixel units; forming a first light-emitting element layer; At least one step between a light-emitting element layer and the formation of the last second light-emitting element layer: forming a second pixel-defining layer, the orthographic projection of the second pixel-defining layer on the first pixel-defining layer falling within the first pixel-defining layer , and the surface pattern of the second pixel defining layer away from the substrate is consistent with the surface pattern of the first pixel defining layer away from the substrate; in the same pixel unit, the first light-emitting element layer and multiple second light-emitting element layers Formed as part of the same OLED. The manufacturing method of the display substrate of the present invention can effectively reduce the risk of inkjet printing medium overflowing.

Description

Technical field [0001] The present invention relates to the field of display technology, in particular to a manufacturing method of a display substrate, a display substrate, and a display device including the display substrate. Background technique [0002] Generally, organic light emitting diodes (OrganicLightEmittingDiode, OLED) have the advantages of self-luminescence, fast response, wide viewing angle, high brightness, bright colors, light and thin compared to liquid crystal displays (LCD), and are considered as next-generation displays. technology. [0003] The thin film deposition methods of organic electroluminescent devices (OLED) mainly include vacuum evaporation and solution process. Among them, vacuum evaporation is suitable for organic small molecules, and its film formation is good, the technology is relatively mature, but the equipment investment is large, the material utilization rate is low, and the mask alignment accuracy of large-size products is low. The soluti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L27/32
CPCH10K71/135H10K59/122H10K71/00
Inventor 侯文军
Owner BOE TECH GRP CO LTD