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Resin composition and application thereof

A resin composition, epoxy resin technology, applied in the direction of synthetic resin layered products, lamination, layered products, etc., to achieve low dielectric loss, meet the needs of low dielectric constant of the sheet, and the effect of high glass transition temperature

Active Publication Date: 2017-07-11
无锡宏仁电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, such requirements are the latest designs, and there are few reports on materials that meet such requirements and are cost-effective.

Method used

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  • Resin composition and application thereof
  • Resin composition and application thereof
  • Resin composition and application thereof

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Embodiment Construction

[0033] In order to facilitate the understanding of the present invention, the following will describe the present invention more fully. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0035] The raw materials adopted in the present embodiment are as follows:

[0036] (...

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Abstract

The invention relates to a resin composition. The resin composition comprises, by weight, 10 to 40 parts of polyepoxy resin, 20 to 50 parts of a curing agent, 0.01 to 1 part of an accelerant, 5 to 40 parts of a functional filling material and 10 to 30 parts of a fire retardant, wherein the polyepoxy resin comprises at least one selected from a group consisting of bisphenol Z type epoxy resin and t-butyl modified phenol phenolic epoxy resin, and / or one or more selected from a group consisting of cyclopentadiene epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin and bisphenol M type epoxy resin. A copper-clad plate prepared from the resin composition has a low dielectric constant (wherein Dk is no more 3.4), low dielectric loss (wherein Df is no more 0.01) and a high glass-transition temperature under the conditions of 1 GHz and RC70. The copper-clad plate can be applied to substrate-like systems to meet requirements of the systems for low dielectric constants of plates.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a resin composition and its application. Background technique [0002] While electronic design continues to improve the performance of the overall machine, it is also striving to reduce its size. In small portable products ranging from mobile phones to smart weapons, "small" is the eternal pursuit. High-density integration (High DensityInterconnection, referred to as HDI) technology can make the design of end products more miniaturized, while meeting higher standards of electronic performance and efficiency. HDI is currently widely used in mobile phones, digital (camera) cameras, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. But at present, HDI, the mainstream mobile phone board, has reached the limit of the active and passive components that can be carried, and more and more functions are wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L85/02C08K7/26C08K7/18C08K3/36C08G59/30C08G59/24C08G59/62C08G59/42C08J5/24B32B15/092B32B15/20B32B27/20B32B33/00B32B37/06
CPCB32B15/092B32B15/20B32B27/20B32B33/00B32B37/06B32B2260/021B32B2260/046C08G59/245C08G59/304C08G59/4223C08G59/4284C08G59/621C08J5/24C08J2363/00C08K2201/003C08K2201/014C08L63/00C08L2203/20C08L2205/025C08L2205/03C08L2205/035C08L85/02C08K3/36C08K7/18C08K7/26
Inventor 李宏途肖浩罗文王建军王铁
Owner 无锡宏仁电子材料科技有限公司
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