Apparatus for reflow soldering of B-surface sockets on A-surface through holes
A reflow soldering and socket technology, applied in the field of socket soldering in electronic assembly PCBA, can solve problems such as multiple soldering defects, insufficient soldering quality, and cumbersomeness, and achieve the effects of improving soldering quality, improving production efficiency, and reducing production costs.
Inactive Publication Date: 2017-07-11
ZTE CORP
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Problems solved by technology
[0003] The process is cumbersome and the efficiency is low; the selective soldering process needs to transfer the veneer turnover after reflow soldering to the selective welding line for welding, which has many procedures and is cumbersome and low in efficiency
[0004] Compared with through-hole reflow soldering, its soldering quality is obviously insufficient; selective soldering usually has more soldering defects, which is not conducive to ensuring product quality
[0005] The process cost is high; selective soldering sometimes needs to make a mask, and the process cost is high
Method used
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[0037] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.
[0038] Assume that one side of the PCB 6 is the B side, and the other side of the PCB 6 is the A side.
[0039] like figure 1 As shown, the embodiment of the present invention provides a device, including: a feeding tray 1, a feeding tool 2, a positioning tool 3 and a reflow soldering tray 4; plugging; the loading tool 2 and the positioning tool 3 are plugged; the positioning tool 3 is clamped on the reflow soldering tray 4 .
[0040] In this embodiment, the socket 5 is plugged into the feeding tool 2 through the feeding tray 1; the feeding tool 2 is plugged into the positioning tool 3; the positioning tool 3 is clamped on the reflow soldering tray 4, a plurality of sockets 5 can be plugged on the feeding tray 1 at one time. Connected to the feeding t...
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The invention provides an apparatus for reflow soldering of B-surface sockets on A-surface through holes, relates to the technical field of socket soldering of radio frequency power amplifier boards in electronic Printed Circuit Board+Assembly (PCBA), overcomes the defect during soldering of the sockets by employing selective welding or manual welding conventional processes in the prior art, and realizes reflow soldering of the B-surface sockets on the A-surface through holes. The apparatus comprises a feeding pallet, a feeding tool, a positioning tool, and a reflow soldering pallet, sockets are plugged with the feeding tool through the feeding pallet, the feeding tool is plugged with the positioning tool, and the positioning tool is clamped on the reflow soldering pallet. According to the scheme, primary plugging of a plurality of sockets on the B-surface of the radio frequency power amplifier board can be realized, reflow soldering of the sockets and devices on the A-surface is performed together, the welding quality and the production efficiency are greatly improved, and the production cost is reduced; the tool is simple, and the operation is easy; the design of the tool is flexible and can be adjusted according to different types of power amplifier boards, and the universality is achieved.
Description
technical field [0001] The invention relates to the technical field of socket welding in electronic assembly PCBA (Printed Circuit Board+Assembly), in particular to a device for through-hole reflow soldering of a B-side socket and A-side. Background technique [0002] At present, the socket on the B side of the RF power amplifier board is usually selectively soldered or manually soldered in the assembly and soldering process after the reflow soldering of the entire board is completed. There are several obvious disadvantages in traditional processes such as selective welding or manual welding: [0003] The process is cumbersome and the efficiency is low; the selective welding process needs to transfer the reflow soldered veneer to the selective welding line for welding, which has many procedures and is cumbersome and low in efficiency. [0004] Compared with through-hole reflow soldering, its soldering quality is obviously insufficient; selective soldering usually has more s...
Claims
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IPC IPC(8): H05K3/34
CPCH01R13/02H05K3/30H05K3/3447H05K2201/10189H05K2203/04
Inventor 胡东东钱宏量王峰杨卫卫徐伟明梁志刚
Owner ZTE CORP