Electromagnetic wave protection film capable of being repeatedly pasted and used

An electromagnetic wave and protective film technology, which is applied in the direction of electrical components, conductive adhesives, magnetic field/electric field shielding, etc., can solve the problems of cumbersome operation, more equipment, and more operators required, and meet the requirements of grounding use, and the cost is significantly reduced , The effect of simple process operation

Inactive Publication Date: 2017-07-18
BAODING LUCKY INNOVATIVE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This processing technology requires rigorous positioning operations to prevent errors in the mounting position of the electromagnetic wave protective film. Once the mounting position is wrong, the coating of the electromagnetic wave protective film is easily damaged when the electromagnetic wave protective film is peeled off, which affects the electromagnetic protection characteristics and the fault tolerance rate. Low, and the electromagnetic wave protective film after heating lamination curing will be permanently mounted on the flexible circuit board, and cannot be repeatedly mounted and used. In addition, the known heating lamination curing process also has the following defects:
[0011] (1) The operation is cumbersome, there are many steps required, and there are many equipment such as laminating machines and ovens, and many operators are required
[0012] (2) The energy consumption is serious and the cost is high
[0013] (3) There are certain risks, such as high-temperature operation, high-temperature heating products produce toxic and harmful substances, etc.

Method used

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  • Electromagnetic wave protection film capable of being repeatedly pasted and used
  • Electromagnetic wave protection film capable of being repeatedly pasted and used
  • Electromagnetic wave protection film capable of being repeatedly pasted and used

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] 1. Preparation of insulating and flexible adhesive layer 2 coating solution

[0061]

[0062] The above-mentioned substances are mixed with a certain proportion of solvents such as toluyphenone, and then dispersed by known high-speed stirring, ball milling, fast hand, grinding and other processes to form a coating liquid, which is reserved for subsequent coating.

[0063] 2. Preparation of pressure-sensitive conductive adhesive layer 4 coating solution

[0064]

[0065] The above-mentioned substances are mixed with a certain proportion of solvents such as toluyphenone, and then dispersed by known high-speed stirring, ball milling, fast hand, grinding and other processes to form a coating liquid, which is reserved for subsequent coating.

[0066] 3. Preparation of electromagnetic wave protective film for repeated placement

[0067] Coat the insulating and flexible adhesive layer 2 coating solution prepared above on the surface of the polyimide film 1 with a thickn...

Embodiment 2

[0069] 1. Preparation of insulating and flexible adhesive layer 2 coating solution

[0070]

[0071] The above-mentioned substances are mixed with a certain proportion of solvents such as toluyphenone, and then dispersed by known high-speed stirring, ball milling, fast hand, grinding and other processes to form a coating liquid, which is reserved for subsequent coating.

[0072] 2. Preparation of pressure-sensitive conductive adhesive layer 4 coating solution

[0073]

[0074]

[0075] The above-mentioned substances are mixed with a certain proportion of solvents such as toluyphenone, and then dispersed by known high-speed stirring, ball milling, fast hand, grinding and other processes to form a coating liquid, which is reserved for subsequent coating.

[0076] 3. Preparation of electromagnetic wave protective film for repeated placement

[0077]Coat the insulating and flexible adhesive layer 2 coating solution prepared above on the surface of the polyimide film 1 wi...

Embodiment 3

[0079] 1. Preparation of insulating and flexible adhesive layer 2 coating solution

[0080]

[0081] The above-mentioned substances are mixed with a certain proportion of solvents such as toluyphenone, and then dispersed by known high-speed stirring, ball milling, fast hand, grinding and other processes to form a coating liquid, which is reserved for subsequent coating.

[0082] 2. Preparation of pressure-sensitive conductive adhesive layer 4 coating solution

[0083]

[0084] The above-mentioned substances are mixed with a certain proportion of solvents such as toluyphenone, and then dispersed by known high-speed stirring, ball milling, fast hand, grinding and other processes to form a coating liquid, which is reserved for subsequent coating.

[0085] 3. Preparation of electromagnetic wave protective film for repeated placement

[0086] Coat the insulating and flexible adhesive layer 2 coating solution configured above on one side of a commercially available 5 μm coppe...

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Abstract

The invention provides an electromagnetic wave protection film capable of being repeatedly pasted and used. In the electromagnetic wave protection film, a surface of a base material is provided with one insulated flexible bonding layer. A surface of the insulated flexible bonding layer is provided with at least one metal layer. A metal layer surface is provided with one pressure-sensitive-type conducting resin layer. A surface of the pressure-sensitive-type conducting resin layer is provided with a protection film. Compared to a tedious heating lamination post curing technology, by using the film of the invention, only a portion which needs the electromagnetic wave protection film is pressed, a processing application technology is simple, and more laminated machines, baking ovens and other equipment are not needed; redundant personnel setting and complicated operation steps are not needed, a tolerable error rate is high, and energy losses and a possibility of generating danger in a subsequent operation can be effectively reduced; and more importantly, after actual positioning and pasting are wrong, repeated positioning usage can be stripped so that a waste edition which is generated because pasting is wrong is not generated. The protection film can be widely applied to portions of a mobile phone, a camera, a medical apparatus, a laptop and the like, such as a FPC soft board, PCB hard board and the like, wherein the portions needs electromagnetic protection.

Description

technical field [0001] The invention relates to the technical field of thin films, in particular to an electromagnetic wave protective film. Background technique [0002] Since the 21st century, with the advent of the information age, the FPC industry, which has gradually shifted from military use to civilian use, has ushered in great opportunities for development. It is widely used in consumer electronics such as computers, cameras, printers, and car audio. With the pursuit of light, thin, short, and small designs in consumer electronics products, the scope of FPC applications has been extended to new fields, including smart phones, PDAs, notebook computers, digital cameras, liquid crystal displays and other miniaturized terminal electronic products. . From the analysis of the development trend of the entire electronic product, future products tend to be thinner, lighter, highly integrated, and three-dimensional dynamic development, and the electromagnetic interference bet...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00C09J7/02C09J9/02C09J183/04C09J167/00C09J163/00
CPCC08K7/00C08K2003/0806C08K2003/085C09J9/02C09J183/04C09J2301/122C09J2301/16C09J2301/302C09J2301/314C09J2301/408C09J2400/163C09J2463/00C09J2467/00C09J2479/086C09J2483/00H05K9/0088
Inventor 季青健郭伟凤杜喜光刘海峰迟大伟罗超刘彦峰
Owner BAODING LUCKY INNOVATIVE MATERIALS
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